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1596 Other Function uPs,uCs & Peripheral ICs 91

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Information Access Method Integrated Cache Interrupt Capability JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Minimum Time Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Ultraviolet Erasable Volatile Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
XCVC1802-1MLIVIVA1596 by Xilinx

XCVC1802-1MLIVIVA1596

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG;

S-PBGA-B1596

40 mm

1596

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1596,40X40,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

40 mm

MICROPROCESSOR CIRCUIT

XCVC1802-1MSEVIVA1596 by Xilinx

XCVC1802-1MSEVIVA1596

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;

S-PBGA-B1596

40 mm

1596

100 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1596,40X40,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

40 mm

MICROPROCESSOR CIRCUIT

XCVC1802-2LLEVIVA1596 by Xilinx

XCVC1802-2LLEVIVA1596

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Width: 40 mm;

S-PBGA-B1596

40 mm

1596

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1596,40X40,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

40 mm

MICROPROCESSOR CIRCUIT

XCVC1802-2LSEVIVA1596 by Xilinx

XCVC1802-2LSEVIVA1596

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B1596;

S-PBGA-B1596

40 mm

1596

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1596,40X40,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

40 mm

MICROPROCESSOR CIRCUIT

XCVC1802-2MLEVIVA1596 by Xilinx

XCVC1802-2MLEVIVA1596

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;

S-PBGA-B1596

40 mm

1596

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1596,40X40,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

40 mm

MICROPROCESSOR CIRCUIT

XCVC1802-2MSIVIVA1596 by Xilinx

XCVC1802-2MSIVIVA1596

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Package Equivalence Code: BGA1596,40X40,36;

S-PBGA-B1596

40 mm

1596

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1596,40X40,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

40 mm

MICROPROCESSOR CIRCUIT

XCVC1902-1MSIVIVA1596 by Xilinx

XCVC1902-1MSIVIVA1596

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Package Equivalence Code: BGA1596,40X40,36;

S-PBGA-B1596

40 mm

1596

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1596,40X40,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

40 mm

MICROPROCESSOR CIRCUIT

XCVC1902-2LLEVIVA1596 by Xilinx

XCVC1902-2LLEVIVA1596

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Minimum Operating Temperature: 0 Cel;

S-PBGA-B1596

40 mm

1596

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1596,40X40,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

40 mm

MICROPROCESSOR CIRCUIT

XCVC1502-2LLEVSVA1596 by Xilinx

XCVC1502-2LLEVSVA1596

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;

S-PBGA-B1596

37.5 mm

1596

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1596,40X40,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

37.5 mm

MICROPROCESSOR CIRCUIT

XCVC1502-1LLIVSVA1596 by Xilinx

XCVC1502-1LLIVSVA1596

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Maximum Supply Voltage: .724 V;

S-PBGA-B1596

37.5 mm

1596

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1596,40X40,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

37.5 mm

MICROPROCESSOR CIRCUIT

XCVC1502-1LSIVSVA1596 by Xilinx

XCVC1502-1LSIVSVA1596

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Minimum Supply Voltage: .676 V;

S-PBGA-B1596

37.5 mm

1596

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1596,40X40,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

37.5 mm

MICROPROCESSOR CIRCUIT

XCVC1502-1MSIVSVA1596 by Xilinx

XCVC1502-1MSIVSVA1596

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG;

S-PBGA-B1596

37.5 mm

1596

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1596,40X40,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

37.5 mm

MICROPROCESSOR CIRCUIT

XCVC1902-2HSIVIVA1596 by Xilinx

XCVC1902-2HSIVIVA1596

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Minimum Supply Voltage: .854 V;

S-PBGA-B1596

40 mm

1596

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1596,40X40,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.906 V

.854 V

.88 V

YES

CMOS

BALL

.92 mm

BOTTOM

40 mm

MICROPROCESSOR CIRCUIT

XCVC1702-2LSEVSVA1596 by Xilinx

XCVC1702-2LSEVSVA1596

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;

S-PBGA-B1596

37.5 mm

1596

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1596,40X40,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

37.5 mm

MICROPROCESSOR CIRCUIT

XCVC1702-2MLEVSVA1596 by Xilinx

XCVC1702-2MLEVSVA1596

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;

S-PBGA-B1596

37.5 mm

1596

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1596,40X40,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

37.5 mm

MICROPROCESSOR CIRCUIT

XCVC1902-2LLIVIVA1596 by Xilinx

XCVC1902-2LLIVIVA1596

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;

S-PBGA-B1596

40 mm

1596

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1596,40X40,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

40 mm

MICROPROCESSOR CIRCUIT

XCVC1702-1LSIVSVA1596 by Xilinx

XCVC1702-1LSIVSVA1596

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Maximum Seated Height: 4 mm;

S-PBGA-B1596

37.5 mm

1596

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1596,40X40,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

37.5 mm

MICROPROCESSOR CIRCUIT

XCVC1702-1MLIVSVA1596 by Xilinx

XCVC1702-1MLIVSVA1596

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Length: 37.5 mm;

S-PBGA-B1596

37.5 mm

1596

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1596,40X40,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

37.5 mm

MICROPROCESSOR CIRCUIT

XCVC1802-2LLIVIVA1596 by Xilinx

XCVC1802-2LLIVIVA1596

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Maximum Seated Height: 4 mm;

S-PBGA-B1596

40 mm

1596

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1596,40X40,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

40 mm

MICROPROCESSOR CIRCUIT

XCVC1702-1LLIVSVA1596 by Xilinx

XCVC1702-1LLIVSVA1596

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;

S-PBGA-B1596

37.5 mm

1596

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1596,40X40,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

37.5 mm

MICROPROCESSOR CIRCUIT

XCVC1702-1MSEVSVA1596 by Xilinx

XCVC1702-1MSEVSVA1596

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Maximum Seated Height: 4 mm;

S-PBGA-B1596

37.5 mm

1596

100 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1596,40X40,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

37.5 mm

MICROPROCESSOR CIRCUIT

XCVC1702-2MSIVSVA1596 by Xilinx

XCVC1702-2MSIVSVA1596

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B1596;

S-PBGA-B1596

37.5 mm

1596

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1596,40X40,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

37.5 mm

MICROPROCESSOR CIRCUIT

XCVC1702-2MSEVSVA1596 by Xilinx

XCVC1702-2MSEVSVA1596

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Nominal Supply Voltage: .8 V;

S-PBGA-B1596

37.5 mm

1596

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1596,40X40,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

37.5 mm

MICROPROCESSOR CIRCUIT

XCVC1702-2HSIVSVA1596 by Xilinx

XCVC1702-2HSIVSVA1596

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Nominal Supply Voltage: .88 V;

S-PBGA-B1596

37.5 mm

1596

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1596,40X40,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.906 V

.854 V

.88 V

YES

CMOS

BALL

.92 mm

BOTTOM

37.5 mm

MICROPROCESSOR CIRCUIT

XCVC1702-2LLEVSVA1596 by Xilinx

XCVC1702-2LLEVSVA1596

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG;

S-PBGA-B1596

37.5 mm

1596

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1596,40X40,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

37.5 mm

MICROPROCESSOR CIRCUIT

XCVC1702-2MLIVSVA1596 by Xilinx

XCVC1702-2MLIVSVA1596

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Package Equivalence Code: BGA1596,40X40,36;

S-PBGA-B1596

37.5 mm

1596

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1596,40X40,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

37.5 mm

MICROPROCESSOR CIRCUIT

XCVC1802-2HSIVIVA1596 by Xilinx

XCVC1802-2HSIVIVA1596

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Terminal Pitch: .92 mm;

S-PBGA-B1596

40 mm

1596

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1596,40X40,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.906 V

.854 V

.88 V

YES

CMOS

BALL

.92 mm

BOTTOM

40 mm

MICROPROCESSOR CIRCUIT

XCVC1702-1LSEVSVA1596 by Xilinx

XCVC1702-1LSEVSVA1596

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Surface Mount: YES;

S-PBGA-B1596

37.5 mm

1596

100 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1596,40X40,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

37.5 mm

MICROPROCESSOR CIRCUIT

XCVC1702-1MSIVSVA1596 by Xilinx

XCVC1702-1MSIVSVA1596

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Terminal Pitch: .92 mm;

S-PBGA-B1596

37.5 mm

1596

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1596,40X40,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

37.5 mm

MICROPROCESSOR CIRCUIT

XCVE1752-1LSEVSVA1596 by Xilinx

XCVE1752-1LSEVSVA1596

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Maximum Supply Voltage: .724 V;

S-PBGA-B1596

37.5 mm

1596

100 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1596,40X40,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

37.5 mm

MICROPROCESSOR CIRCUIT

XCVE1752-1MLIVSVA1596 by Xilinx

XCVE1752-1MLIVSVA1596

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Width: 37.5 mm;

S-PBGA-B1596

37.5 mm

1596

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1596,40X40,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

37.5 mm

MICROPROCESSOR CIRCUIT

XCVE1752-2LSEVSVA1596 by Xilinx

XCVE1752-2LSEVSVA1596

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Maximum Seated Height: 4 mm;

S-PBGA-B1596

37.5 mm

1596

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1596,40X40,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

37.5 mm

MICROPROCESSOR CIRCUIT

XCVE1752-2MLEVSVA1596 by Xilinx

XCVE1752-2MLEVSVA1596

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Maximum Seated Height: 4 mm;

S-PBGA-B1596

37.5 mm

1596

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1596,40X40,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

37.5 mm

MICROPROCESSOR CIRCUIT

XCVE1752-2MSIVSVA1596 by Xilinx

XCVE1752-2MSIVSVA1596

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Width: 37.5 mm;

S-PBGA-B1596

37.5 mm

1596

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1596,40X40,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

37.5 mm

MICROPROCESSOR CIRCUIT

XCVE1752-1MSEVSVA1596 by Xilinx

XCVE1752-1MSEVSVA1596

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Surface Mount: YES;

S-PBGA-B1596

37.5 mm

1596

100 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1596,40X40,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

37.5 mm

MICROPROCESSOR CIRCUIT

XCVE1752-1MSIVSVA1596 by Xilinx

XCVE1752-1MSIVSVA1596

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;

S-PBGA-B1596

37.5 mm

1596

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1596,40X40,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

37.5 mm

MICROPROCESSOR CIRCUIT

XCVE1752-2LLEVSVA1596 by Xilinx

XCVE1752-2LLEVSVA1596

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Minimum Supply Voltage: .676 V;

S-PBGA-B1596

37.5 mm

1596

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1596,40X40,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

37.5 mm

MICROPROCESSOR CIRCUIT

XCVE1752-2MLIVSVA1596 by Xilinx

XCVE1752-2MLIVSVA1596

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Maximum Operating Temperature: 110 Cel;

S-PBGA-B1596

37.5 mm

1596

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1596,40X40,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

37.5 mm

MICROPROCESSOR CIRCUIT

XCVE1752-2MSEVSVA1596 by Xilinx

XCVE1752-2MSEVSVA1596

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG;

S-PBGA-B1596

37.5 mm

1596

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1596,40X40,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

37.5 mm

MICROPROCESSOR CIRCUIT

XCVE1752-1LLIVSVA1596 by Xilinx

XCVE1752-1LLIVSVA1596

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG;

S-PBGA-B1596

37.5 mm

1596

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1596,40X40,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

37.5 mm

MICROPROCESSOR CIRCUIT

XCVE1752-1LSIVSVA1596 by Xilinx

XCVE1752-1LSIVSVA1596

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Technology: CMOS;

S-PBGA-B1596

37.5 mm

1596

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1596,40X40,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

37.5 mm

MICROPROCESSOR CIRCUIT

XCVM1402-2HSIVFVC1596 by Xilinx

XCVM1402-2HSIVFVC1596

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: BGA; Package Shape: SQUARE; Maximum Seated Height: 3.75 mm;

S-PBGA-B1596

37.5 mm

1596

110 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1596,40X40,36

SQUARE

GRID ARRAY

3.75 mm

.906 V

.854 V

.88 V

YES

CMOS

BALL

.92 mm

BOTTOM

37.5 mm

MICROPROCESSOR CIRCUIT

XCVM1302-2HSIVFVC1596 by Xilinx

XCVM1302-2HSIVFVC1596

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B1596;

S-PBGA-B1596

37.5 mm

1596

110 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1596,40X40,36

SQUARE

GRID ARRAY

3.75 mm

.906 V

.854 V

.88 V

YES

CMOS

BALL

.92 mm

BOTTOM

37.5 mm

MICROPROCESSOR CIRCUIT