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SYSTEM ON CHIP Multi-functional Peripherals 2

Multi-functional Peripherals
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Ultraviolet Erasable Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
MIMX8MN6CVTIZAA by NXP Semiconductors

MIMX8MN6CVTIZAA

NXP Semiconductors

SYSTEM ON CHIP; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e2; Terminal Finish: TIN SILVER; Peak Reflow Temperature (C): 260;

e2

3

260

TIN SILVER

40

SYSTEM ON CHIP

MIMX8MN1CVPIZAA by NXP Semiconductors

MIMX8MN1CVPIZAA

NXP Semiconductors

SYSTEM ON CHIP; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e6; Terminal Finish: Tin/Bismuth (Sn/Bi); Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40;

e6

3

260

Tin/Bismuth (Sn/Bi)

40

SYSTEM ON CHIP