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Renesas Electronics Microprocessors 9

Microprocessors
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Additional Features Address Bus Width Bit Size Boundary Scan CPU Family Maximum Clock Frequency DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Serial I/Os No. of Terminals On Chip Data RAM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability Screening Level Maximum Seated Height Speed Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Width Peripheral IC Type Data EEPROM Size Connectivity
HD6417705F133BV by Renesas Electronics

HD6417705F133BV

Renesas Electronics

MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 208; Package Code: QFP; Package Shape: SQUARE;

32

S-PQFP-G208

208

70 Cel

-20 Cel

PLASTIC/EPOXY

QFP

QFP208,1.2SQ,20

SQUARE

FLATPACK

1.5,3.3

Not Qualified

133 rpm

Microprocessors

200 mA

YES

CMOS

COMMERCIAL

GULL WING

.5 mm

QUAD

MICROPROCESSOR, RISC

HD6417727BP160CV by Renesas Electronics

HD6417727BP160CV

Renesas Electronics

MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: BALL; No. of Terminals: 240; Package Code: LFBGA; Package Shape: SQUARE;

26

32

YES

66.67 MHz

32

FIXED POINT

YES

S-PBGA-B240

13 mm

YES

4

6

3

240

8

75 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA240,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.9,3.3

Not Qualified

16384

1.4 mm

160 rpm

Microprocessors

650 mA

2.05 V

1.7 V

1.9 V

YES

CMOS

COMMERCIAL EXTENDED

BALL

.65 mm

BOTTOM

13 mm

MICROPROCESSOR, RISC

HD6417727BP100CV by Renesas Electronics

HD6417727BP100CV

Renesas Electronics

MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 240; Package Code: LFBGA; Package Shape: SQUARE;

26

32

YES

50 MHz

32

FIXED POINT

YES

S-PBGA-B240

13 mm

YES

4

6

3

240

8

70 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA240,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.9,3.3

Not Qualified

16384

1.4 mm

100 rpm

Microprocessors

450 mA

2.05 V

1.6 V

1.9 V

YES

CMOS

COMMERCIAL

BALL

.65 mm

BOTTOM

13 mm

MICROPROCESSOR, RISC

D6417751RBA240HVU0 by Renesas Electronics

D6417751RBA240HVU0

Renesas Electronics

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

IT ALSO OPERATES AT 1.5 V

32

32

YES

.032768 MHz

32

FLOATING POINT

YES

S-PBGA-B256

27 mm

YES

3

256

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

2.6 mm

240 rpm

3.6 V

3 V

3.3 V

YES

CMOS

INDUSTRIAL

BALL

1.27 mm

BOTTOM

27 mm

MICROPROCESSOR, RISC

D6417750RBA240HVU0 by Renesas Electronics

D6417750RBA240HVU0

Renesas Electronics

Renesas Electronics D6417750RBA240HVU0 microprocessor features 32-bit architecture, 64-bit external data bus width, and 34 MHz max clock frequency. Ideal for industrial applications requiring high-speed processing with low power consumption. Terminal pitch of 1.27 mm and integrated cache make it suitable for compact designs in various electronic devices.

26

32

YES

34 MHz

64

FLOATING POINT

YES

S-PBGA-B256

27 mm

YES

3

256

85 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

2.6 mm

240 rpm

1.6 V

1.35 V

1.5 V

YES

CMOS

INDUSTRIAL

BALL

1.27 mm

BOTTOM

27 mm

MICROPROCESSOR, RISC

HD6417750SX200V by Renesas Electronics

HD6417750SX200V

Renesas Electronics

MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;

26

32

YES

67 MHz

64

FLOATING POINT

YES

S-PQFP-G208

e6

28 mm

YES

208

75 Cel

-20 Cel

PLASTIC/EPOXY

FQFP

SQUARE

FLATPACK, FINE PITCH

3.56 mm

200 rpm

2.07 V

1.8 V

1.95 V

YES

CMOS

COMMERCIAL EXTENDED

TIN BISMUTH

GULL WING

.5 mm

QUAD

28 mm

MICROPROCESSOR, RISC

HD6417727X100CV by Renesas Electronics

HD6417727X100CV

Renesas Electronics

MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 240; Package Code: FQFP; Package Shape: SQUARE; Length: 32 mm;

26

32

YES

50 MHz

32

FIXED POINT

YES

S-PQFP-G240

32 mm

YES

4

6

3

240

8

75 Cel

-20 Cel

PLASTIC/EPOXY

FQFP

QFP240,1.3SQ,20

SQUARE

FLATPACK, FINE PITCH

NOT SPECIFIED

16384

3.95 mm

100 rpm

450 mA

2.05 V

1.6 V

1.9 V

YES

CMOS

GULL WING

.5 mm

QUAD

NOT SPECIFIED

32 mm

MICROPROCESSOR, RISC

HD6417727X160CV by Renesas Electronics

HD6417727X160CV

Renesas Electronics

MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 240; Package Code: FQFP; Package Shape: SQUARE; Package Style (Meter): FLATPACK, FINE PITCH;

26

32

YES

66.67 MHz

32

FIXED POINT

YES

S-PQFP-G240

32 mm

YES

4

6

3

240

8

75 Cel

-20 Cel

PLASTIC/EPOXY

FQFP

QFP240,1.3SQ,20

SQUARE

FLATPACK, FINE PITCH

NOT SPECIFIED

16384

3.95 mm

160 rpm

650 mA

2.05 V

1.7 V

1.9 V

YES

CMOS

GULL WING

.5 mm

QUAD

NOT SPECIFIED

32 mm

MICROPROCESSOR, RISC

HD6417750SX167V by Renesas Electronics

HD6417750SX167V

Renesas Electronics

MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE; No. of External Interrupts: 5;

26

32

YES

34 MHz

64

FLOATING POINT

YES

S-PQFP-G208

28 mm

YES

4

5

2

208

8

75 Cel

-20 Cel

PLASTIC/EPOXY

FQFP

QFP208,1.2SQ,20

SQUARE

FLATPACK, FINE PITCH

3.56 mm

167 rpm

650 mA

2 V

1.6 V

1.8 V

YES

CMOS

GULL WING

.5 mm

QUAD

28 mm

MICROPROCESSOR, RISC