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MICROCONTROLLER, RISC Microprocessors 7

Microprocessors
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Serial I/Os No. of Terminals On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability Screening Level Maximum Seated Height Speed Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
MIMXRT1062DVJ6A by NXP Semiconductors

MIMXRT1062DVJ6A

NXP Semiconductors

MICROCONTROLLER, RISC; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN SILVER; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; JESD-609 Code: e2;

e2

3

260

TIN SILVER

40

MICROCONTROLLER, RISC

MIMXRT1062DVL6A by NXP Semiconductors

MIMXRT1062DVL6A

NXP Semiconductors

MICROCONTROLLER, RISC; Terminal Finish: TIN SILVER COPPER; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;

e1

3

260

TIN SILVER COPPER

40

MICROCONTROLLER, RISC

MIMXRT1061DVL6A by NXP Semiconductors

MIMXRT1061DVL6A

NXP Semiconductors

MICROCONTROLLER, RISC; JESD-609 Code: e1; Terminal Finish: TIN SILVER COPPER; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3;

e1

3

260

TIN SILVER COPPER

40

MICROCONTROLLER, RISC

MIMXRT1061DVJ6B by NXP Semiconductors

MIMXRT1061DVJ6B

NXP Semiconductors

MICROCONTROLLER, RISC; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN SILVER; JESD-609 Code: e2;

e2

3

260

TIN SILVER

40

MICROCONTROLLER, RISC

MIMXRT1061DVL6B by NXP Semiconductors

MIMXRT1061DVL6B

NXP Semiconductors

MICROCONTROLLER, RISC; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e1; Peak Reflow Temperature (C): 260;

e1

3

260

TIN SILVER COPPER

40

MICROCONTROLLER, RISC

MIMXRT106ADVL6A by NXP Semiconductors

MIMXRT106ADVL6A

NXP Semiconductors

MICROCONTROLLER, RISC; Terminal Finish: TIN SILVER COPPER; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 3;

e1

3

260

TIN SILVER COPPER

40

MICROCONTROLLER, RISC

MIMXRT1062DVL6B by NXP Semiconductors

MIMXRT1062DVL6B

NXP Semiconductors

MICROCONTROLLER, RISC; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN SILVER COPPER; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;

e1

3

260

TIN SILVER COPPER

40

MICROCONTROLLER, RISC