Loading...

783 Microprocessors 6

Microprocessors
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Serial I/Os No. of Terminals On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability Screening Level Maximum Seated Height Speed Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
MPC8569EVTAUNLB by Freescale Semiconductor

MPC8569EVTAUNLB

Freescale Semiconductor

MPC8569EVTAUNLB by Freescale: 32-bit microprocessor with 64-bit data bus, 16-bit address bus, and integrated cache. Ideal for RISC applications requiring low power mode, operating at max clock frequency of 133 MHz. Features grid array package style suitable for surface mount assembly.

16

32

YES

133 MHz

64

FLOATING POINT

YES

S-PBGA-B783

29 mm

YES

3

783

PLASTIC/EPOXY

HBGA

BGA783,28X28,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

245

1.1,2.5/3.3

Not Qualified

3.94 mm

1333 rpm

Microprocessors

1.133 V

1.067 V

1.1 V

YES

CMOS

TIN SILVER COPPER OVER NICKEL

BALL

1 mm

BOTTOM

30

29 mm

MICROPROCESSOR, RISC

MPC8544CVTALF by Freescale Semiconductor

MPC8544CVTALF

Freescale Semiconductor

MPC8544CVTALF by Freescale: 32-bit microprocessor with integrated cache, max. clock freq. of 133 MHz. Ideal for low power applications, featuring boundary scan and CMOS technology. Package style is grid array with heat sink/slug, suitable for surface mount assembly at a terminal pitch of 1 mm.

0

32

YES

133 MHz

0

FLOATING POINT

YES

S-PBGA-B783

e2

29 mm

YES

3

783

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

260

2.8 mm

667 rpm

1.05 V

.95 V

1 V

YES

CMOS

TIN SILVER

BALL

1 mm

BOTTOM

40

29 mm

MICROPROCESSOR

MPC8544CVTAQG by Freescale Semiconductor

MPC8544CVTAQG

Freescale Semiconductor

The Freescale Semiconductor MPC8544CVTAQG is a 32-bit microprocessor with integrated cache, operating at a max clock frequency of 133 MHz. It features low power mode and boundary scan capabilities, making it suitable for high-speed applications requiring efficient processing in a compact package. The processor's CMOS technology and floating-point format enhance its performance in various industrial settings.

0

32

YES

133 MHz

0

FLOATING POINT

YES

S-PBGA-B783

e2

29 mm

YES

3

783

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

260

2.8 mm

1000 rpm

1.05 V

.95 V

1 V

YES

CMOS

TIN SILVER

BALL

1 mm

BOTTOM

40

29 mm

MICROPROCESSOR

MPC8540VT833LB by Freescale Semiconductor

MPC8540VT833LB

Freescale Semiconductor

The Freescale Semiconductor MPC8540VT833LB microprocessor features a 64-bit address bus, 32-bit bit size, and integrated cache. It is suitable for applications requiring high-speed processing with a max clock frequency of 166 MHz. The package style is grid array with a terminal pitch of 1 mm.

64

32

YES

166 MHz

64

FIXED POINT

YES

S-PBGA-B783

e2

29 mm

YES

3

783

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA783,28X28,40

SQUARE

GRID ARRAY

260

1.2,2.5/3.3

Not Qualified

3.85 mm

667 rpm

Microprocessors

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

Tin/Silver (Sn/Ag)

BALL

1 mm

BOTTOM

40

29 mm

MICROPROCESSOR

MPC8535AVJANGA by NXP Semiconductors

MPC8535AVJANGA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 783; Package Code: BGA; Package Shape: SQUARE;

16

32

YES

64

FIXED POINT

YES

S-PBGA-B783

e2

29 mm

YES

3

783

90 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

2.76 mm

800 rpm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

1 mm

BOTTOM

40

29 mm

MICROPROCESSOR

MPC8535BVJANGA by NXP Semiconductors

MPC8535BVJANGA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 783; Package Code: BGA; Package Shape: SQUARE;

16

32

YES

64

FIXED POINT

YES

S-PBGA-B783

e2

29 mm

YES

3

783

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

2.76 mm

800 rpm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

1 mm

BOTTOM

40

29 mm

MICROPROCESSOR