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488 Microprocessors 3

Microprocessors
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Serial I/Os No. of Terminals On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability Screening Level Maximum Seated Height Speed Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
MCIMX7D7DVK10SC by NXP Semiconductors

MCIMX7D7DVK10SC

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 488; Package Code: TFBGA; Package Shape: SQUARE; Bit Size: 32;

16

32

YES

32

FLOATING POINT

YES

S-PBGA-B488

12 mm

YES

3

488

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.1 mm

1000 rpm

1.155 V

1.045 V

1.1 V

YES

CMOS

BALL

.4 mm

BOTTOM

40

12 mm

MICROPROCESSOR, RISC

MCIMX7S3DVK08SC by NXP Semiconductors

MCIMX7S3DVK08SC

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 488; Package Code: TFBGA; Package Shape: SQUARE;

SEATED-HGT CALCULATED

16

32

YES

32

FLOATING POINT

YES

S-PBGA-B488

12 mm

YES

3

488

95 Cel

0 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.1 mm

800 rpm

1.155 V

.95 V

1 V

YES

CMOS

OTHER

BALL

.4 mm

BOTTOM

40

12 mm

MICROPROCESSOR, RISC

MCIMX7S3EVK08SC by NXP Semiconductors

MCIMX7S3EVK08SC

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 488; Package Code: TFBGA; Package Shape: SQUARE;

SEATED-HGT CALCULATED

16

32

YES

32

FLOATING POINT

YES

S-PBGA-B488

12 mm

YES

3

488

105 Cel

-20 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.1 mm

800 rpm

1.155 V

.95 V

1 V

YES

CMOS

OTHER

BALL

.4 mm

BOTTOM

40

12 mm

MICROPROCESSOR, RISC