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193 Microprocessors 1

Microprocessors
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Serial I/Os No. of Terminals On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability Screening Level Maximum Seated Height Speed Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
TMP19A43FDXBG by Toshiba

TMP19A43FDXBG

Toshiba

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 193; Package Code: BGA; Package Shape: SQUARE;

24

32

YES

40 MHz

16

FIXED POINT

NO

S-PBGA-B193

NO

193

85 Cel

-20 Cel

PLASTIC/EPOXY

BGA

BGA193,14X14,25

SQUARE

GRID ARRAY

1.5,2.5,3.3

Not Qualified

24576

524288

FLASH

40 rpm

Microcontrollers

74 mA

1.65 V

1.35 V

YES

CMOS

OTHER

BALL

.635 mm

BOTTOM

MICROPROCESSOR, RISC