Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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XC17S05PD8C
Xilinx
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Length: 9.3599 mm;
10 MHz
COMMON
R-PDIP-T8
e0
9.3599 mm
53984 bit
MEMORY CIRCUIT
1
8
53984 words
53984
SYNCHRONOUS
70 Cel
0 Cel
53984X1
3-STATE
PLASTIC/EPOXY
DIP
DIP8,.3
RECTANGULAR
IN-LINE
225
5
Not Qualified
4.5974 mm
.00005 Amp
OTP ROMs
10 mA
5.25 V
4.75 V
NO
CMOS
COMMERCIAL
TIN LEAD
THROUGH-HOLE
2.54 mm
DUAL
30
7.62 mm
XC17S05PD8I
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Seated Height: 4.5974 mm;
85 Cel
-40 Cel
5.5 V
4.5 V
INDUSTRIAL
XC17S05XLPD8C
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Finish: TIN LEAD;
54544 bit
54544 words
54544
54544X1
3.3
5 mA
3.6 V
3 V
XC17S10PD8C
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): 225;
95008 bit
95008 words
95008
95008X1
XC17S10PD8I
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDIP-T8;
XC17S10XLPD8C
The Xilinx XC17S10XLPD8C is a 95752-bit memory circuit IC with 3.3V supply voltage, operating at up to 10MHz clock frequency. It features synchronous operation, common I/O type, and 3-STATE output characteristics. Ideal for applications requiring low power consumption and high-speed memory access in commercial-grade environments.
95752 bit
95752 words
95752
95752X1
XC17S10XLPD8I
XC17S20PD8C
The Xilinx XC17S20PD8C is a 178144-bit memory circuit IC with synchronous operation and 3-STATE output. It operates at a max clock frequency of 10 MHz, suitable for applications requiring high-speed memory access. With a package style of IN-LINE and through-hole terminal form, it is commonly used in commercial-grade systems needing reliable memory storage.
178144 bit
178144 words
178144
178144X1
Tin/Lead (Sn85Pb15)
XC17S20PD8I
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; JESD-609 Code: e0;
XC17S20XLPD8C
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Memory Width: 1;
179160 bit
179160 words
179160
179160X1
XC17S20XLPD8I
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Length: 9.3599 mm;
XC17S30PD8C
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
247968 bit
247968 words
247968
247968X1
XC17S30PD8I
XC17S30PD8I by Xilinx is a 247968-bit MEMORY CIRCUIT with 3-STATE output characteristics. Operating at 10 MHz clock frequency, it has an industrial temperature grade and synchronous mode. Commonly used in applications requiring reliable memory storage and retrieval within the industrial sector.
XC17S30XLPD8C
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Supply Current: 5 mA;
249168 bit
249168 words
249168
249168X1
XC17S30XLPD8I
XC17S30XLPD8I by Xilinx is a 249168-bit MEMORY CIRCUIT with 3.3V supply, operating at up to 10MHz clock frequency. It features an industrial temperature grade range from -40°C to 85°C and offers a synchronous operation mode. This IC is commonly used in applications requiring high-speed memory functions.
XC17S40PD8C
329312 bit
329312 words
329312
329312X1
XC17S40PD8I
XC17S40PD8I by Xilinx is a 329312-bit MEMORY CIRCUIT IC with 3-STATE output, operating at up to 10 MHz clock frequency. It features a synchronous mode, common I/O type, and operates in industrial temperature range. Ideal for applications requiring high memory density and low standby current.
XC17S40XLPD8C
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Seated Height: 4.5974 mm;
330696 bit
330696 words
330696
330696X1
XC17S40XLPD8I
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words Code: 330696;
XC17S40SO20C
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 5;
R-PDSO-G20
12.8 mm
3
20
SOP
SOP20,.4
SMALL OUTLINE
2.65 mm
YES
GULL WING
1.27 mm
7.5 mm
XC17S40SO20I
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR; Package Equivalence Code: SOP20,.4;
XC17S40XLSO20C
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
XC17S40XLSO20I
The Xilinx XC17S40XLSO20I is a 3.3V memory circuit IC with 330696 bits, operating synchronously at up to 10MHz. It features a small outline package with 20 terminals and is ideal for industrial applications requiring common I/O type and 3-STATE output characteristics.
XC17S05VO8C
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: TSOP2; Package Shape: RECTANGULAR; Terminal Pitch: 1.27 mm;
R-PDSO-G8
4.9 mm
TSOP2
TSOP8,.25
SMALL OUTLINE, THIN PROFILE
1.2 mm
3.9 mm
XC17S05VO8I
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Standby Current: .00005 Amp;
XC17S05XLVO8C
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: TSOP2; Package Shape: RECTANGULAR; Organization: 54544X1;
XC17S05XLVO8I
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: TSOP2; Package Shape: RECTANGULAR; Organization: 54544X1;
XC17S10VO8C
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Operating Temperature: 70 Cel;
XC17S10VO8I
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: TSOP2; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 3;
XC17S10XLVO8C
XC17S10XLVO8I
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: TSOP2; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G8;
XC17S20VO8C
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: TSOP2; Package Shape: RECTANGULAR; Input/Output Type: COMMON;
XC17S20VO8I
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: TSOP2; Package Shape: RECTANGULAR; Memory Density: 178144 bit;
XC17S20XLVO8C
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: TSOP2; Package Shape: RECTANGULAR; No. of Words: 179160 words;
XC17S20XLVO8I
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Clock Frequency (fCLK): 10 MHz;
XC17S30VO8C
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Clock Frequency (fCLK): 10 MHz;
XC17S30VO8I
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: TSOP2; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
XC17S30XLVO8C
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: TSOP2; Package Shape: RECTANGULAR; Technology: CMOS;
XC17S30XLVO8I
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: TSOP2; Package Shape: RECTANGULAR; Organization: 249168X1;
XC17S150XLPD8C
Xilinx XC17S150XLPD8C is a 1040128-bit MEMORY CIRCUIT with 3.3V supply, 10MHz clock frequency, and 70°C operating temp. Ideal for applications requiring synchronous operation in commercial-grade environments.
1040128 bit
1040128 words
1040128
1040128X1
XC17S150XLSO20C
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Finish: TIN LEAD;
XCCACEM16BG388I
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 388; Package Code: BGA; Package Shape: SQUARE; Parallel or Serial: SERIAL;
1000000 Write/Erase Cycles
S-PBGA-B388
35 mm
16777216 bit
16
388
1048576 words
1M
1MX16
BGA
BGA388,26X26,50
SQUARE
GRID ARRAY
SERIAL
1.8,3.3
2.87 mm
Flash Memories
240 mA
1.89 V
1.71 V
1.8
BALL
BOTTOM
NOR TYPE
XCCACEM32BG388I
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 388; Package Code: BGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
33554432 bit
2097152 words
2M
2MX16
XCCACEM64BG388I
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 388; Package Code: BGA; Package Shape: SQUARE; JESD-609 Code: e0;
133 MHz
67108864 bit
4194304 words
4M
4MX16
XC17S10VOG8C
e3
260
Matte Tin (Sn)
XC17S10XLVOG8C
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): 30;
XC17S10XLVOG8I
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: TSOP2; Package Shape: RECTANGULAR; JESD-609 Code: e3;
XC17S20XLVOG8C
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