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56 Other Function Memory ICs 4

Other Function Memory ICs
Part# Info Specs
Part RoHS Manufacturer Description Access Mode Maximum Access Time Additional Features Boot Block Maximum Clock Frequency (fCLK) Command User Interface Common Flash Interface Data Polling Minimum Data Retention Time Endurance Input/Output Type I2C Control Byte Interleaved Burst Length JESD-30 Code JESD-609 Code Length Memory Density Memory IC Type Memory Width Mixed Memory Type Moisture Sensitivity Level (MSL) No. of Functions No. of Ports No. of Sectors/Size No. of Terminals No. of Words No. of Words Code Operating Mode Maximum Operating Temperature Minimum Operating Temperature Organization Output Characteristics Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Page Size (words) Parallel or Serial Peak Reflow Temperature (C) Power Supplies (V) Programming Voltage (V) Qualification Refresh Cycles Reverse Pinout Screening Level Maximum Seated Height Sector Size (Words) Self Refresh Sequential Burst Length Serial Bus Type Maximum Standby Current Minimum Standby Voltage Sub-Category Maximum Supply Current Maximum Supply Voltage (Vsup) Minimum Supply Voltage (Vsup) Nominal Supply Voltage / Vsup (V) Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Toggle Bit Total Dose (V) Type Width Write Protection
NP8P128A13BSM60E by Micron Technology

NP8P128A13BSM60E

Micron Technology

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 56; Package Code: TSOP1; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3;

R-PDSO-G56

18.4 mm

134217728 bit

MEMORY CIRCUIT

8

1

56

16777216 words

16M

SYNCHRONOUS

70 Cel

0 Cel

16MX8

PLASTIC/EPOXY

TSOP1

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

1.2 mm

3.6 V

2.7 V

3

YES

CMOS

COMMERCIAL

GULL WING

.5 mm

DUAL

14 mm

NP8P128A13TSM60E by Micron Technology

NP8P128A13TSM60E

Micron Technology

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 56; Package Code: TSOP1; Package Shape: RECTANGULAR; Surface Mount: YES;

R-PDSO-G56

18.4 mm

134217728 bit

MEMORY CIRCUIT

8

1

56

16777216 words

16M

SYNCHRONOUS

70 Cel

0 Cel

16MX8

PLASTIC/EPOXY

TSOP1

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

1.2 mm

3.6 V

2.7 V

3

YES

CMOS

COMMERCIAL

GULL WING

.5 mm

DUAL

14 mm

NP8P128AE3TSM60E by Micron Technology

NP8P128AE3TSM60E

Micron Technology

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: TSOP1; Package Shape: RECTANGULAR; Terminal Position: DUAL;

R-PDSO-G56

18.4 mm

134217728 bit

MEMORY CIRCUIT

8

1

56

16777216 words

16M

SYNCHRONOUS

85 Cel

-40 Cel

16MX8

PLASTIC/EPOXY

TSOP1

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

1.2 mm

3.6 V

2.7 V

3

YES

CMOS

INDUSTRIAL

GULL WING

.5 mm

DUAL

14 mm

CY8C24033-24PVXI by Cypress Semiconductor

CY8C24033-24PVXI

Cypress Semiconductor

CY8C24033-24PVXI by Cypress: 8KX1 memory circuit with 8192-bit density. Operates synchronously, industrial grade, -40 to 85°C range. Ideal for applications requiring small outline, shrink pitch package and CMOS technology.

R-PDSO-G56

18.415 mm

8192 bit

MEMORY CIRCUIT

1

1

56

8192 words

8K

SYNCHRONOUS

85 Cel

-40 Cel

8KX1

PLASTIC/EPOXY

SSOP

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

Not Qualified

2.794 mm

5.25 V

3 V

YES

CMOS

INDUSTRIAL

GULL WING

.635 mm

DUAL

7.5057 mm