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388 Other Function Memory ICs 3

Other Function Memory ICs
Part# Info Specs
Part RoHS Manufacturer Description Access Mode Maximum Access Time Additional Features Boot Block Maximum Clock Frequency (fCLK) Command User Interface Common Flash Interface Data Polling Minimum Data Retention Time Endurance Input/Output Type I2C Control Byte Interleaved Burst Length JESD-30 Code JESD-609 Code Length Memory Density Memory IC Type Memory Width Mixed Memory Type Moisture Sensitivity Level (MSL) No. of Functions No. of Ports No. of Sectors/Size No. of Terminals No. of Words No. of Words Code Operating Mode Maximum Operating Temperature Minimum Operating Temperature Organization Output Characteristics Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Page Size (words) Parallel or Serial Peak Reflow Temperature (C) Power Supplies (V) Programming Voltage (V) Qualification Refresh Cycles Reverse Pinout Screening Level Maximum Seated Height Sector Size (Words) Self Refresh Sequential Burst Length Serial Bus Type Maximum Standby Current Minimum Standby Voltage Sub-Category Maximum Supply Current Maximum Supply Voltage (Vsup) Minimum Supply Voltage (Vsup) Nominal Supply Voltage / Vsup (V) Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Toggle Bit Total Dose (V) Type Width Write Protection
XCCACEM16BG388I by Xilinx

XCCACEM16BG388I

Xilinx

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 388; Package Code: BGA; Package Shape: SQUARE; Parallel or Serial: SERIAL;

20

1000000 Write/Erase Cycles

S-PBGA-B388

35 mm

16777216 bit

MEMORY CIRCUIT

16

1

1

388

1048576 words

1M

SYNCHRONOUS

85 Cel

-40 Cel

1MX16

PLASTIC/EPOXY

BGA

BGA388,26X26,50

SQUARE

GRID ARRAY

SERIAL

1.8,3.3

Not Qualified

2.87 mm

Flash Memories

240 mA

1.89 V

1.71 V

1.8

YES

CMOS

INDUSTRIAL

BALL

1.27 mm

BOTTOM

NOR TYPE

35 mm

XCCACEM32BG388I by Xilinx

XCCACEM32BG388I

Xilinx

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 388; Package Code: BGA; Package Shape: SQUARE; Terminal Position: BOTTOM;

20

1000000 Write/Erase Cycles

S-PBGA-B388

e0

35 mm

33554432 bit

MEMORY CIRCUIT

16

1

1

388

2097152 words

2M

SYNCHRONOUS

85 Cel

-40 Cel

2MX16

PLASTIC/EPOXY

BGA

BGA388,26X26,50

SQUARE

GRID ARRAY

SERIAL

1.8,3.3

Not Qualified

2.87 mm

Flash Memories

240 mA

1.89 V

1.71 V

1.8

YES

CMOS

INDUSTRIAL

TIN LEAD

BALL

1.27 mm

BOTTOM

NOR TYPE

35 mm

XCCACEM64BG388I by Xilinx

XCCACEM64BG388I

Xilinx

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 388; Package Code: BGA; Package Shape: SQUARE; JESD-609 Code: e0;

133 MHz

1000000 Write/Erase Cycles

S-PBGA-B388

e0

35 mm

67108864 bit

MEMORY CIRCUIT

16

1

388

4194304 words

4M

SYNCHRONOUS

85 Cel

-40 Cel

4MX16

PLASTIC/EPOXY

BGA

BGA388,26X26,50

SQUARE

GRID ARRAY

SERIAL

1.8,3.3

Not Qualified

2.87 mm

Flash Memories

240 mA

1.89 V

1.71 V

1.8

YES

CMOS

INDUSTRIAL

TIN LEAD

BALL

1.27 mm

BOTTOM

NOR TYPE

35 mm