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TFBGA FRAMs 4

FRAMs
Part# Info Specs
Part RoHS Manufacturer Description Maximum Access Time Additional Features Maximum Clock Frequency (fCLK) Minimum Data Retention Time Endurance JESD-30 Code JESD-609 Code Length Memory Density Memory IC Type Memory Width Moisture Sensitivity Level (MSL) No. of Functions No. of Terminals No. of Words No. of Words Code Operating Mode Maximum Operating Temperature Minimum Operating Temperature Organization Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Parallel or Serial Peak Reflow Temperature (C) Power Supplies (V) Qualification Screening Level Maximum Seated Height Serial Bus Type Maximum Standby Current Minimum Standby Voltage Sub-Category Maximum Supply Current Maximum Supply Voltage (Vsup) Minimum Supply Voltage (Vsup) Nominal Supply Voltage / Vsup (V) Surface Mount Technology Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Width Write Protection
CY15B108QN-50BKXIT by Infineon Technologies

CY15B108QN-50BKXIT

Infineon Technologies

FRAM; No. of Terminals: 24; Package Code: TFBGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH; No. of Functions: 1;

50 MHz

10

1000000000000000 Write/Erase Cycles

R-PBGA-B24

8 mm

8388608 bit

FRAM

8

1

24

1048576 words

1M

SYNCHRONOUS

85 Cel

-40 Cel

1MX8

PLASTIC/EPOXY

TFBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

SERIAL

1.2 mm

SPI

.000135 Amp

1.8 V

4.5 mA

3.6 V

1.8 V

3.3

YES

CMOS

BALL

1 mm

BOTTOM

6 mm

HARDWARE/SOFTWARE

CY15V108QN-50BKXIT by Infineon Technologies

CY15V108QN-50BKXIT

Infineon Technologies

FRAM; No. of Terminals: 24; Package Code: TFBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY; Write Protection: HARDWARE/SOFTWARE;

50 MHz

10

1000000000000000 Write/Erase Cycles

R-PBGA-B24

8 mm

8388608 bit

FRAM

8

1

24

1048576 words

1M

SYNCHRONOUS

85 Cel

-40 Cel

1MX8

PLASTIC/EPOXY

TFBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

SERIAL

1.2 mm

SPI

.000135 Amp

1.71 V

4.5 mA

1.89 V

1.71 V

1.8

YES

CMOS

BALL

1 mm

BOTTOM

6 mm

HARDWARE/SOFTWARE

CY15B108QN-50BKXI by Infineon Technologies

CY15B108QN-50BKXI

Infineon Technologies

Infineon's CY15B108QN-50BKXI FRAM offers 1MX8 organization, operates at 50MHz clock frequency, and has a memory density of 8388608 bit. Ideal for applications requiring high endurance, such as IoT devices and industrial automation systems.

50 MHz

10

1000000000000000 Write/Erase Cycles

R-PBGA-B24

8 mm

8388608 bit

FRAM

8

1

24

1048576 words

1M

SYNCHRONOUS

85 Cel

-40 Cel

1MX8

PLASTIC/EPOXY

TFBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

SERIAL

1.2 mm

SPI

.000135 Amp

1.8 V

4.5 mA

3.6 V

1.8 V

3.3

YES

CMOS

BALL

1 mm

BOTTOM

6 mm

HARDWARE/SOFTWARE

CY15V108QN-50BKXI by Infineon Technologies

CY15V108QN-50BKXI

Infineon Technologies

FRAM; No. of Terminals: 24; Package Code: TFBGA; Package Shape: RECTANGULAR; Width: 6 mm; No. of Functions: 1;

50 MHz

10

1000000000000000 Write/Erase Cycles

R-PBGA-B24

8 mm

8388608 bit

FRAM

8

1

24

1048576 words

1M

SYNCHRONOUS

85 Cel

-40 Cel

1MX8

PLASTIC/EPOXY

TFBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

SERIAL

1.2 mm

SPI

.000135 Amp

1.71 V

4.5 mA

1.89 V

1.71 V

1.8

YES

CMOS

BALL

1 mm

BOTTOM

6 mm

HARDWARE/SOFTWARE