Loading...

CONFIGURATION MEMORY Flash Memory 4

Flash Memory
Part# Info Specs
Part RoHS Manufacturer Description Maximum Access Time Additional Features Alternate Memory Width Boot Block Maximum Clock Frequency (fCLK) Command User Interface Common Flash Interface Data Polling Minimum Data Retention Time Endurance Input/Output Type JESD-30 Code JESD-609 Code Length Memory Density Memory IC Type Memory Width Moisture Sensitivity Level (MSL) No. of Functions No. of Ports No. of Sectors/Size No. of Terminals No. of Words No. of Words Code Operating Mode Maximum Operating Temperature Minimum Operating Temperature Organization Output Characteristics Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Page Size (words) Parallel or Serial Peak Reflow Temperature (C) Power Supplies (V) Programming Voltage (V) Qualification Ready or Busy Screening Level Maximum Seated Height Sector Size (Words) Serial Bus Type Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage (Vsup) Minimum Supply Voltage (Vsup) Nominal Supply Voltage / Vsup (V) Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Toggle Bit Type Width Maximum Write Cycle Time (tWC) Write Protection
XCF04SVOG20C by Xilinx

XCF04SVOG20C

Xilinx

Xilinx XCF04SVOG20C is a 4MX1 NOR flash memory with 4194304-bit density. Operating at 3.3V, it offers 20000 write/erase cycles and supports synchronous mode up to 33MHz clock frequency. Ideal for configuration memory in applications requiring high endurance and low standby current.

33 MHz

20

20000 Write/Erase Cycles

R-PDSO-G20

e3

6.5024 mm

4194304 bit

CONFIGURATION MEMORY

1

3

1

20

4194304 words

4M

SYNCHRONOUS

85 Cel

-40 Cel

4MX1

PLASTIC/EPOXY

TSSOP

TSSOP20,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

SERIAL

260

1.8/3.3,3.3

3.3

Not Qualified

1.19 mm

.01 Amp

Flash Memories

10 mA

3.6 V

3 V

3.3

YES

CMOS

Matte Tin (Sn)

GULL WING

.65 mm

DUAL

30

NOR TYPE

4.4 mm

HARDWARE

2988780 by Phoenix Contact

2988780

Phoenix Contact

CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; Package Shape: RECTANGULAR; No. of Words Code: 256M; Length: 36.4 mm; Width: 3.3 mm;

36.4 mm

2147483648 bit

CONFIGURATION MEMORY

8

1

268435456 words

256M

85 Cel

-40 Cel

256MX8

RECTANGULAR

3.3

42.8 mm

3.465 V

3.135 V

3.3

NO

CMOS

INDUSTRIAL

3.3 mm

2701185 by Phoenix Contact

2701185

Phoenix Contact

CONFIGURATION MEMORY; Package Code: DIE; Package Shape: RECTANGULAR; Maximum Seated Height: 3.3 mm; JESD-30 Code: R-XUUC-N; Maximum Operating Temperature: 85 Cel;

R-XUUC-N

42.8 mm

17179869184 bit

CONFIGURATION MEMORY

8

1

2147483648 words

2G

85 Cel

-40 Cel

2GX8

UNSPECIFIED

DIE

RECTANGULAR

UNCASED CHIP

3.3

3.3 mm

3.465 V

3.135 V

3.3

YES

CMOS

NO LEAD

UPPER

NOR TYPE

36.4 mm

1624092 by Phoenix Contact

1624092

Phoenix Contact

Phoenix Contact 1624092 Flash Memory features NOR type technology, 17179869184-bit memory density, and 3.3V nominal voltage. Ideal for applications requiring high-speed data storage in a compact rectangular package with surface mount capability.

R-XUUC-N

17179869184 bit

CONFIGURATION MEMORY

8

1

2147483648 words

2G

85 Cel

-40 Cel

2GX8

UNSPECIFIED

DIE

DIE OR CHIP

RECTANGULAR

UNCASED CHIP

3.3

3.6 V

2.7 V

3.3

YES

CMOS

NO LEAD

UPPER

NOR TYPE