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COMMERCIAL EXTENDED DRAM 4

DRAM
Part# Info Specs
Part RoHS Manufacturer Description Access Mode Maximum Access Time Additional Features Alternate Memory Width Maximum Clock Frequency (fCLK) Input/Output Type Interleaved Burst Length JESD-30 Code JESD-609 Code Length Memory Density Memory IC Type Memory Width Mixed Memory Type Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage No. of Functions No. of Ports No. of Terminals No. of Words No. of Words Code Operating Mode Maximum Operating Temperature Minimum Operating Temperature Organization Output Characteristics Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Parallel or Serial Peak Reflow Temperature (C) Power Supplies (V) Qualification Refresh Cycles Reverse Pinout Screening Level Maximum Seated Height Self Refresh Sequential Burst Length Maximum Standby Current Minimum Standby Voltage Sub-Category Maximum Supply Current Maximum Supply Voltage (Vsup) Minimum Supply Voltage (Vsup) Nominal Supply Voltage / Vsup (V) Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Width
MT47H128M8HQ-3:ETR by Micron Technology

MT47H128M8HQ-3:ETR

Micron Technology

DDR2 DRAM; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 60; Package Code: TFBGA; Package Shape: RECTANGULAR; Qualification: Not Qualified;

MULTI BANK PAGE BURST

.45 ns

AUTO/SELF REFRESH

R-PBGA-B60

e1

11.5 mm

1073741824 bit

DDR2 DRAM

8

1

1

60

134217728 words

128M

SYNCHRONOUS

85 Cel

0 Cel

128MX8

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

260

Not Qualified

1.2 mm

YES

1.9 V

1.7 V

1.8

YES

CMOS

COMMERCIAL EXTENDED

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

30

8 mm

MT48LC8M16LFB4-8XT:G by Micron Technology

MT48LC8M16LFB4-8XT:G

Micron Technology

SYNCHRONOUS DRAM; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 54; Package Code: VFBGA; Refresh Cycles: 4096; Package Shape: SQUARE;

FOUR BANK PAGE BURST

7 ns

AUTO/SELF REFRESH

125 MHz

COMMON

1,2,4,8

S-PBGA-B54

e1

8 mm

134217728 bit

SYNCHRONOUS DRAM

16

1

1

54

8388608 words

8M

SYNCHRONOUS

75 Cel

-25 Cel

8MX16

3-STATE

PLASTIC/EPOXY

VFBGA

BGA54,9X9,32

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

3.3

Not Qualified

4096

1 mm

YES

1,2,4,8,FP

.00045 Amp

DRAMs

210 mA

3.6 V

3 V

3.3

YES

CMOS

COMMERCIAL EXTENDED

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

8 mm

MT48LC8M16LFF4-8XT:G by Micron Technology

MT48LC8M16LFF4-8XT:G

Micron Technology

SYNCHRONOUS DRAM; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 54; Package Code: VFBGA; Refresh Cycles: 4096; Package Shape: SQUARE;

FOUR BANK PAGE BURST

7 ns

AUTO/SELF REFRESH

125 MHz

COMMON

1,2,4,8

S-PBGA-B54

e0

8 mm

134217728 bit

SYNCHRONOUS DRAM

16

1

1

54

8388608 words

8M

SYNCHRONOUS

75 Cel

-25 Cel

8MX16

3-STATE

PLASTIC/EPOXY

VFBGA

BGA54,9X9,32

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

3.3

Not Qualified

4096

1 mm

YES

1,2,4,8,FP

.00045 Amp

DRAMs

210 mA

3.6 V

3 V

3.3

YES

CMOS

COMMERCIAL EXTENDED

TIN LEAD SILVER

BALL

.8 mm

BOTTOM

8 mm

MT48LC8M16LFTG-75:G by Micron Technology

MT48LC8M16LFTG-75:G

Micron Technology

SYNCHRONOUS DRAM; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 54; Package Code: VFBGA; Package Shape: SQUARE; Surface Mount: YES;

FOUR BANK PAGE BURST

7 ns

AUTO/SELF REFRESH

S-PBGA-B54

e0

8 mm

134217728 bit

SYNCHRONOUS DRAM

16

1

1

54

8388608 words

8M

SYNCHRONOUS

75 Cel

-25 Cel

8MX16

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Not Qualified

1 mm

YES

3.6 V

3 V

3.3

YES

CMOS

COMMERCIAL EXTENDED

TIN LEAD SILVER

BALL

.8 mm

BOTTOM

8 mm