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24 DRAM 25

DRAM
Part# Info Specs
Part RoHS Manufacturer Description Access Mode Maximum Access Time Additional Features Alternate Memory Width Maximum Clock Frequency (fCLK) Input/Output Type Interleaved Burst Length JESD-30 Code JESD-609 Code Length Memory Density Memory IC Type Memory Width Mixed Memory Type Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage No. of Functions No. of Ports No. of Terminals No. of Words No. of Words Code Operating Mode Maximum Operating Temperature Minimum Operating Temperature Organization Output Characteristics Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Parallel or Serial Peak Reflow Temperature (C) Power Supplies (V) Qualification Refresh Cycles Reverse Pinout Screening Level Maximum Seated Height Self Refresh Sequential Burst Length Maximum Standby Current Minimum Standby Voltage Sub-Category Maximum Supply Current Maximum Supply Voltage (Vsup) Minimum Supply Voltage (Vsup) Nominal Supply Voltage / Vsup (V) Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Width
TMS48C128-80DJ by Texas Instruments

TMS48C128-80DJ

Texas Instruments

TMS48C128-80DJ by Texas Instruments is a 128Kx8 FAST PAGE DRAM with 80ns access time, operating at 5V. It features 3-STATE output characteristics and consumes up to 80mA. Ideal for applications requiring high-speed memory operations in commercial temperature environments.

FAST PAGE

80 ns

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

COMMON

R-PDSO-J24

17.145 mm

1048576 bit

FAST PAGE DRAM

8

1

1

24

131072 words

128K

ASYNCHRONOUS

70 Cel

0 Cel

128KX8

3-STATE

PLASTIC/EPOXY

SOJ

SOJ24/26,.34

RECTANGULAR

SMALL OUTLINE

NOT SPECIFIED

5

Not Qualified

512

3.76 mm

.002 Amp

DRAMs

80 mA

5.5 V

4.5 V

5

YES

CMOS

COMMERCIAL

J BEND

1.27 mm

DUAL

NOT SPECIFIED

7.57 mm

S27KL0642GABHM020 by Infineon Technologies

S27KL0642GABHM020

Infineon Technologies

HYPERRAM; No. of Terminals: 24; Package Code: BGA; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel; Memory Width: 1;

35 ns

200 MHz

R-PBGA-B24

67108864 bit

HYPERRAM

1

3

1

1

24

67108864 words

64M

SYNCHRONOUS

125 Cel

-40 Cel

64MX1

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

AEC-Q100

3.6 V

2.7 V

3

YES

CMOS

BALL

BOTTOM

S27KS0642GABHM023 by Infineon Technologies

S27KS0642GABHM023

Infineon Technologies

HYPERRAM; No. of Terminals: 24; Package Code: BGA; Package Shape: RECTANGULAR; Organization: 64MX1; Screening Level: AEC-Q100;

35 ns

200 MHz

R-PBGA-B24

67108864 bit

HYPERRAM

1

3

1

1

24

67108864 words

64M

SYNCHRONOUS

125 Cel

-40 Cel

64MX1

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

AEC-Q100

2 V

1.7 V

1.8

YES

CMOS

BALL

BOTTOM

S70KL1282GABHM020 by Infineon Technologies

S70KL1282GABHM020

Infineon Technologies

HYPERRAM; No. of Terminals: 24; Package Code: BGA; Package Shape: RECTANGULAR; No. of Words Code: 128M; Terminal Position: BOTTOM;

35 ns

200 MHz

COMMON

R-PBGA-B240

134217728 bit

HYPERRAM

1

3

1

1

24

134217728 words

128M

SYNCHRONOUS

125 Cel

-40 Cel

128MX1

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

AEC-Q100

3.6 V

2.7 V

3

YES

CMOS

BALL

BOTTOM

S27KS0642GABHM020 by Infineon Technologies

S27KS0642GABHM020

Infineon Technologies

HYPERRAM; No. of Terminals: 24; Package Code: BGA; Package Shape: RECTANGULAR; Terminal Position: BOTTOM; Package Body Material: PLASTIC/EPOXY;

35 ns

200 MHz

R-PBGA-B24

67108864 bit

HYPERRAM

1

3

1

1

24

67108864 words

64M

SYNCHRONOUS

125 Cel

-40 Cel

64MX1

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

AEC-Q100

2 V

1.7 V

1.8

YES

CMOS

BALL

BOTTOM

S70KS1282GABHM023 by Infineon Technologies

S70KS1282GABHM023

Infineon Technologies

HYPERRAM; No. of Terminals: 24; Package Code: BGA; Package Shape: RECTANGULAR; Technology: CMOS; Memory Width: 1;

35 ns

200 MHz

R-PBGA-B24

134217728 bit

HYPERRAM

1

3

1

1

24

134217728 words

128M

SYNCHRONOUS

125 Cel

-40 Cel

128MX1

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

AEC-Q100

3.6 V

1.7 V

1.8

YES

CMOS

BALL

BOTTOM

S27KL0642GABHM023 by Infineon Technologies

S27KL0642GABHM023

Infineon Technologies

HYPERRAM; No. of Terminals: 24; Package Code: BGA; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 3; Package Body Material: PLASTIC/EPOXY;

35 ns

200 MHz

R-PBGA-B24

67108864 bit

HYPERRAM

1

3

1

1

24

67108864 words

64M

SYNCHRONOUS

125 Cel

-40 Cel

64MX1

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

AEC-Q100

3.6 V

2.7 V

YES

CMOS

BALL

BOTTOM

S70KL1282GABHM023 by Infineon Technologies

S70KL1282GABHM023

Infineon Technologies

HYPERRAM; No. of Terminals: 24; Package Code: BGA; Package Shape: RECTANGULAR; No. of Words: 134217728 words; Screening Level: AEC-Q100;

35 ns

200 MHz

R-PBGA-B24

134217728 bit

HYPERRAM

1

3

1

1

24

134217728 words

128M

SYNCHRONOUS

125 Cel

-40 Cel

128MX1

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

AEC-Q100

3.6 V

2.7 V

3

YES

CMOS

BALL

BOTTOM

S70KS1282GABHM020 by Infineon Technologies

S70KS1282GABHM020

Infineon Technologies

HYPERRAM; No. of Terminals: 24; Package Code: BGA; Package Shape: RECTANGULAR; Organization: 128MX1; Maximum Operating Temperature: 125 Cel;

35 ns

200 MHz

R-PBGA-B24

134217728 bit

HYPERRAM

1

3

1

1

24

134217728 words

128M

SYNCHRONOUS

125 Cel

-40 Cel

128MX1

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

AEC-Q100

2 V

1.7 V

1.8

YES

CMOS

BALL

BOTTOM

S27KL0642GABHA023 by Infineon Technologies

S27KL0642GABHA023

Infineon Technologies

Infineon's S27KL0642GABHA023 DRAM features 8MX8 organization, operates synchronously at up to 200 MHz, and has a memory density of 67108864 bits. Ideal for automotive applications due to AEC-Q100 screening level and common I/O type.

200 MHz

COMMON

R-PBGA-B24

8 mm

67108864 bit

HYPERRAM

8

3

1

1

24

8388608 words

8M

SYNCHRONOUS

85 Cel

-40 Cel

8MX8

3-STATE

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE

AEC-Q100

1 mm

YES

.00025 Amp

30 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

6 mm

S27KL0642GABHV023 by Infineon Technologies

S27KL0642GABHV023

Infineon Technologies

HYPERRAM; No. of Terminals: 24; Package Code: VBGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B24; Minimum Supply Voltage (Vsup): 2.7 V;

200 MHz

COMMON

R-PBGA-B24

8 mm

67108864 bit

HYPERRAM

8

3

1

1

24

8388608 words

8M

SYNCHRONOUS

105 Cel

-40 Cel

8MX8

3-STATE

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE

1 mm

YES

.00036 Amp

30 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

6 mm

S27KL0642GABHV020 by Infineon Technologies

S27KL0642GABHV020

Infineon Technologies

HYPERRAM; No. of Terminals: 24; Package Code: VBGA; Package Shape: RECTANGULAR; Surface Mount: YES; Memory Density: 67108864 bit;

200 MHz

COMMON

R-PBGA-B24

8 mm

67108864 bit

HYPERRAM

8

3

1

1

24

8388608 words

8M

SYNCHRONOUS

105 Cel

-40 Cel

8MX8

3-STATE

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE

1 mm

YES

.00036 Amp

30 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

6 mm

S70KL1282GABHV023 by Infineon Technologies

S70KL1282GABHV023

Infineon Technologies

HYPERRAM; No. of Terminals: 24; Package Code: VBGA; Package Shape: RECTANGULAR; Package Equivalence Code: BGA24,5X5,40; Package Body Material: PLASTIC/EPOXY;

200 MHz

COMMON

R-PBGA-B24

8 mm

134217728 bit

HYPERRAM

8

3

1

1

24

16777216 words

16M

SYNCHRONOUS

105 Cel

-40 Cel

16MX8

3-STATE

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE

1 mm

YES

.00075 Amp

60 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

6 mm

S27KL0643DPBHV020 by Infineon Technologies

S27KL0643DPBHV020

Infineon Technologies

HYPERRAM; No. of Terminals: 24; Package Code: VBGA; Package Shape: RECTANGULAR; Maximum Standby Current: .00036 Amp; No. of Words: 8388608 words;

35 ns

SELF REFRESH

166 MHz

COMMON

R-PBGA-B24

8 mm

67108864 bit

HYPERRAM

8

3

1

1

24

8388608 words

8M

SYNCHRONOUS

105 Cel

-40 Cel

8MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE

1 mm

YES

.00036 Amp

28 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

6 mm

S27KL0643DPBHV023 by Infineon Technologies

S27KL0643DPBHV023

Infineon Technologies

HYPERRAM; No. of Terminals: 24; Package Code: VBGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B24; Organization: 8MX8;

35 ns

SELF REFRESH

166 MHz

COMMON

R-PBGA-B24

8 mm

67108864 bit

HYPERRAM

8

3

1

1

24

8388608 words

8M

SYNCHRONOUS

105 Cel

-40 Cel

8MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE

1 mm

YES

.00036 Amp

28 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

6 mm

S70KL1283GABHV020 by Infineon Technologies

S70KL1283GABHV020

Infineon Technologies

HYPERRAM; No. of Terminals: 24; Package Code: VBGA; Package Shape: RECTANGULAR; Self Refresh: YES; Minimum Operating Temperature: -40 Cel;

35 ns

SELF REFRESH

200 MHz

COMMON

R-PBGA-B24

8 mm

134217728 bit

HYPERRAM

8

3

1

1

24

16777216 words

16M

SYNCHRONOUS

105 Cel

-40 Cel

16MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE

1 mm

YES

.00075 Amp

60 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

6 mm

S27KL0643DPBHI020 by Infineon Technologies

S27KL0643DPBHI020

Infineon Technologies

HYPERRAM; No. of Terminals: 24; Package Code: VBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY; Technology: CMOS;

35 ns

SELF REFRESH

166 MHz

COMMON

R-PBGA-B24

8 mm

67108864 bit

HYPERRAM

8

3

1

1

24

8388608 words

8M

SYNCHRONOUS

85 Cel

-40 Cel

8MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE

1 mm

YES

.00025 Amp

28 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

6 mm

S27KL0643DPBHI023 by Infineon Technologies

S27KL0643DPBHI023

Infineon Technologies

HYPERRAM; No. of Terminals: 24; Package Code: VBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY; Maximum Supply Voltage (Vsup): 3.6 V;

35 ns

SELF REFRESH

166 MHz

COMMON

R-PBGA-B24

8 mm

67108864 bit

HYPERRAM

8

3

1

1

24

8388608 words

8M

SYNCHRONOUS

85 Cel

-40 Cel

8MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE

1 mm

YES

.00025 Amp

28 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

6 mm

S27KL0643GABHV023 by Infineon Technologies

S27KL0643GABHV023

Infineon Technologies

HYPERRAM; No. of Terminals: 24; Package Code: VBGA; Package Shape: RECTANGULAR; Technology: CMOS; Package Equivalence Code: BGA24,5X5,40;

35 ns

SELF REFRESH

200 MHz

COMMON

R-PBGA-B24

8 mm

67108864 bit

HYPERRAM

8

3

1

1

24

8388608 words

8M

SYNCHRONOUS

105 Cel

-40 Cel

8MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE

1 mm

YES

.00036 Amp

30 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

6 mm

S70KL1283DPBHI020 by Infineon Technologies

S70KL1283DPBHI020

Infineon Technologies

HYPERRAM; No. of Terminals: 24; Package Code: VBGA; Package Shape: RECTANGULAR; Maximum Clock Frequency (fCLK): 166 MHz; Self Refresh: YES;

35 ns

SELF REFRESH

166 MHz

COMMON

R-PBGA-B24

8 mm

134217728 bit

HYPERRAM

8

3

1

1

24

16777216 words

16M

SYNCHRONOUS

85 Cel

-40 Cel

16MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE

1 mm

YES

.0005 Amp

56 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

6 mm

S70KL1283DPBHI023 by Infineon Technologies

S70KL1283DPBHI023

Infineon Technologies

HYPERRAM; No. of Terminals: 24; Package Code: VBGA; Package Shape: RECTANGULAR; Maximum Seated Height: 1 mm; Technology: CMOS;

35 ns

SELF REFRESH

166 MHz

COMMON

R-PBGA-B24

8 mm

134217728 bit

HYPERRAM

8

3

1

1

24

16777216 words

16M

SYNCHRONOUS

85 Cel

-40 Cel

16MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE

1 mm

YES

.0005 Amp

56 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

6 mm

S70KL1283GABHV023 by Infineon Technologies

S70KL1283GABHV023

Infineon Technologies

HYPERRAM; No. of Terminals: 24; Package Code: VBGA; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 3; Package Style (Meter): GRID ARRAY, VERY THIN PROFILE;

35 ns

SELF REFRESH

200 MHz

COMMON

R-PBGA-B24

8 mm

134217728 bit

HYPERRAM

8

3

1

1

24

16777216 words

16M

SYNCHRONOUS

105 Cel

-40 Cel

16MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE

1 mm

YES

.00075 Amp

60 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

6 mm

S27KL0643GABHV020 by Infineon Technologies

S27KL0643GABHV020

Infineon Technologies

HYPERRAM; No. of Terminals: 24; Package Code: VBGA; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3; No. of Words: 8388608 words;

35 ns

SELF REFRESH

200 MHz

COMMON

R-PBGA-B24

8 mm

67108864 bit

HYPERRAM

8

3

1

1

24

8388608 words

8M

SYNCHRONOUS

105 Cel

-40 Cel

8MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE

1 mm

YES

.00036 Amp

30 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

6 mm

S27KL0642GABHI030 by Infineon Technologies

S27KL0642GABHI030

Infineon Technologies

HYPERRAM; No. of Terminals: 24; Package Code: VBGA; Package Shape: RECTANGULAR; Maximum Clock Frequency (fCLK): 200 MHz; Memory Width: 8;

SELF REFRESH

200 MHz

COMMON

R-PBGA-B24

8 mm

67108864 bit

HYPERRAM

8

3

1

1

24

8388608 words

8M

SYNCHRONOUS

85 Cel

-40 Cel

8MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE

1 mm

YES

.00025 Amp

30 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

6 mm

S27KL0642GABHI033 by Infineon Technologies

S27KL0642GABHI033

Infineon Technologies

HYPERRAM; No. of Terminals: 24; Package Code: VBGA; Package Shape: RECTANGULAR; Input/Output Type: COMMON; Maximum Clock Frequency (fCLK): 200 MHz;

SELF REFRESH

200 MHz

COMMON

R-PBGA-B24

8 mm

67108864 bit

HYPERRAM

8

3

1

1

24

8388608 words

8M

SYNCHRONOUS

85 Cel

-40 Cel

8MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE

1 mm

YES

.00025 Amp

30 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

6 mm