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RLDRAM3 DRAM 9

DRAM
Part# Info Specs
Part RoHS Manufacturer Description Access Mode Maximum Access Time Additional Features Alternate Memory Width Maximum Clock Frequency (fCLK) Input/Output Type Interleaved Burst Length JESD-30 Code JESD-609 Code Length Memory Density Memory IC Type Memory Width Mixed Memory Type Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage No. of Functions No. of Ports No. of Terminals No. of Words No. of Words Code Operating Mode Maximum Operating Temperature Minimum Operating Temperature Organization Output Characteristics Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Parallel or Serial Peak Reflow Temperature (C) Power Supplies (V) Qualification Refresh Cycles Reverse Pinout Screening Level Maximum Seated Height Self Refresh Sequential Burst Length Maximum Standby Current Minimum Standby Voltage Sub-Category Maximum Supply Current Maximum Supply Voltage (Vsup) Minimum Supply Voltage (Vsup) Nominal Supply Voltage / Vsup (V) Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Width
MT44K16M36RB-093F:BTR by Micron Technology

MT44K16M36RB-093F:BTR

Micron Technology

RLDRAM3; No. of Terminals: 168; Package Code: TBGA; Package Shape: SQUARE; Maximum Clock Frequency (fCLK): 1075.2 MHz; No. of Functions: 1;

MULTI BANK PAGE BURST

AUTO REFRESH

1075.2 MHz

COMMON

2,4,8

S-PBGA-B168

e1

13.5 mm

603979776 bit

RLDRAM3

36

1

1

168

16777216 words

16M

SYNCHRONOUS

95 Cel

0 Cel

16MX36

PLASTIC/EPOXY

TBGA

BGA168,13X13,40

SQUARE

GRID ARRAY, THIN PROFILE

260

1.2 mm

NO

2,4,8

.225 Amp

2840 mA

1.45 V

1.28 V

1.35

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

13.5 mm

MT44K16M36RB-107E:BTR by Micron Technology

MT44K16M36RB-107E:BTR

Micron Technology

RLDRAM3; No. of Terminals: 168; Package Code: TBGA; Package Shape: SQUARE; Organization: 16MX36; Width: 13.5 mm;

MULTI BANK PAGE BURST

AUTO REFRESH

934.5 MHz

COMMON

2,4,8

S-PBGA-B168

e1

13.5 mm

603979776 bit

RLDRAM3

36

1

1

168

16777216 words

16M

SYNCHRONOUS

95 Cel

0 Cel

16MX36

PLASTIC/EPOXY

TBGA

BGA168,13X13,40

SQUARE

GRID ARRAY, THIN PROFILE

260

1.2 mm

NO

2,4,8

.225 Amp

2665 mA

1.45 V

1.28 V

1.35

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

13.5 mm

MT44K32M18RB-093E:BTR by Micron Technology

MT44K32M18RB-093E:BTR

Micron Technology

RLDRAM3; No. of Terminals: 168; Package Code: TBGA; Package Shape: SQUARE; Minimum Supply Voltage (Vsup): 1.28 V; Maximum Clock Frequency (fCLK): 1075.2 MHz;

MULTI BANK PAGE BURST

AUTO REFRESH

1075.2 MHz

COMMON

2,4,8

S-PBGA-B168

e1

13.5 mm

603979776 bit

RLDRAM3

18

1

1

168

33554432 words

32M

SYNCHRONOUS

95 Cel

0 Cel

32MX18

PLASTIC/EPOXY

TBGA

BGA168,13X13,40

SQUARE

GRID ARRAY, THIN PROFILE

260

1.2 mm

NO

2,4,8

.225 Amp

2620 mA

1.45 V

1.28 V

1.35

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

13.5 mm

MT44K32M18RB-107E:BTR by Micron Technology

MT44K32M18RB-107E:BTR

Micron Technology

RLDRAM3; No. of Terminals: 168; Package Code: TBGA; Package Shape: SQUARE; JESD-609 Code: e1; Length: 13.5 mm;

MULTI BANK PAGE BURST

AUTO REFRESH

934.5 MHz

COMMON

2,4,8

S-PBGA-B168

e1

13.5 mm

603979776 bit

RLDRAM3

18

1

1

168

33554432 words

32M

SYNCHRONOUS

95 Cel

0 Cel

32MX18

PLASTIC/EPOXY

TBGA

BGA168,13X13,40

SQUARE

GRID ARRAY, THIN PROFILE

260

1.2 mm

NO

2,4,8

.225 Amp

2565 mA

1.45 V

1.28 V

1.35

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

13.5 mm

MT44K32M18RB-107EIT:BTR by Micron Technology

MT44K32M18RB-107EIT:BTR

Micron Technology

RLDRAM3; No. of Terminals: 168; Package Code: TBGA; Package Shape: SQUARE; Maximum Supply Current: 2565 mA; Package Style (Meter): GRID ARRAY, THIN PROFILE;

MULTI BANK PAGE BURST

AUTO REFRESH

934.5 MHz

COMMON

2,4,8

S-PBGA-B168

13.5 mm

603979776 bit

RLDRAM3

18

1

1

168

33554432 words

32M

SYNCHRONOUS

95 Cel

-40 Cel

32MX18

PLASTIC/EPOXY

TBGA

BGA168,13X13,40

SQUARE

GRID ARRAY, THIN PROFILE

1.2 mm

NO

2,4,8

.225 Amp

2565 mA

1.45 V

1.28 V

1.35

YES

CMOS

BALL

1 mm

BOTTOM

13.5 mm

MT44K32M18RB-125E:ATR by Micron Technology

MT44K32M18RB-125E:ATR

Micron Technology

RLDRAM3; No. of Terminals: 168; Package Code: TBGA; Package Shape: SQUARE; Terminal Form: BALL; Minimum Operating Temperature: 0 Cel;

MULTI BANK PAGE BURST

AUTO REFRESH

800 MHz

COMMON

2,4,8

S-PBGA-B168

13.5 mm

603979776 bit

RLDRAM3

18

1

1

168

33554432 words

32M

SYNCHRONOUS

95 Cel

0 Cel

32MX18

PLASTIC/EPOXY

TBGA

BGA168,13X13,40

SQUARE

GRID ARRAY, THIN PROFILE

NOT SPECIFIED

1.2 mm

NO

2,4,8

1.45 V

1.28 V

1.35

YES

CMOS

BALL

1 mm

BOTTOM

NOT SPECIFIED

13.5 mm

MT44K32M36RB-093E:ATR by Micron Technology

MT44K32M36RB-093E:ATR

Micron Technology

RLDRAM3; No. of Terminals: 168; Package Code: TBGA; Package Shape: SQUARE; Minimum Supply Voltage (Vsup): 1.28 V; Organization: 32MX36;

MULTI BANK PAGE BURST

AUTO REFRESH

1075.2 MHz

COMMON

2,4,8

S-PBGA-B168

e1

13.5 mm

1207959552 bit

RLDRAM3

36

1

1

168

33554432 words

32M

SYNCHRONOUS

95 Cel

0 Cel

32MX36

PLASTIC/EPOXY

TBGA

BGA168,13X13,40

SQUARE

GRID ARRAY, THIN PROFILE

260

1.2 mm

NO

2,4,8

.225 Amp

1140 mA

1.45 V

1.28 V

1.35

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

13.5 mm

MT44K32M36RB-107E:ATR by Micron Technology

MT44K32M36RB-107E:ATR

Micron Technology

RLDRAM3; No. of Terminals: 168; Package Code: TBGA; Package Shape: SQUARE; Memory Width: 36; Memory Density: 1207959552 bit;

MULTI BANK PAGE BURST

AUTO REFRESH

934.5 MHz

COMMON

2,4,8

S-PBGA-B168

e1

13.5 mm

1207959552 bit

RLDRAM3

36

1

1

168

33554432 words

32M

SYNCHRONOUS

95 Cel

0 Cel

32MX36

PLASTIC/EPOXY

TBGA

BGA168,13X13,40

SQUARE

GRID ARRAY, THIN PROFILE

260

1.2 mm

NO

2,4,8

.225 Amp

1070 mA

1.45 V

1.28 V

1.35

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

13.5 mm

MT44K32M36RB-107EIT:ATR by Micron Technology

MT44K32M36RB-107EIT:ATR

Micron Technology

RLDRAM3; No. of Terminals: 168; Package Code: TBGA; Package Shape: SQUARE; Sequential Burst Length: 2,4,8; Minimum Operating Temperature: -40 Cel;

MULTI BANK PAGE BURST

AUTO REFRESH

934.5 MHz

COMMON

2,4,8

S-PBGA-B168

13.5 mm

1207959552 bit

RLDRAM3

36

1

1

168

33554432 words

32M

SYNCHRONOUS

95 Cel

-40 Cel

32MX36

PLASTIC/EPOXY

TBGA

BGA168,13X13,40

SQUARE

GRID ARRAY, THIN PROFILE

1.2 mm

NO

2,4,8

.225 Amp

1070 mA

1.45 V

1.28 V

1.35

YES

CMOS

BALL

1 mm

BOTTOM

13.5 mm