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LPDDR3 DRAM DRAM 19

DRAM
Part# Info Specs
Part RoHS Manufacturer Description Access Mode Maximum Access Time Additional Features Alternate Memory Width Maximum Clock Frequency (fCLK) Input/Output Type Interleaved Burst Length JESD-30 Code JESD-609 Code Length Memory Density Memory IC Type Memory Width Mixed Memory Type Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage No. of Functions No. of Ports No. of Terminals No. of Words No. of Words Code Operating Mode Maximum Operating Temperature Minimum Operating Temperature Organization Output Characteristics Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Parallel or Serial Peak Reflow Temperature (C) Power Supplies (V) Qualification Refresh Cycles Reverse Pinout Screening Level Maximum Seated Height Self Refresh Sequential Burst Length Maximum Standby Current Minimum Standby Voltage Sub-Category Maximum Supply Current Maximum Supply Voltage (Vsup) Minimum Supply Voltage (Vsup) Nominal Supply Voltage / Vsup (V) Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Width
EDF8132A3MA-JD-F-D by Micron Technology

EDF8132A3MA-JD-F-D

Micron Technology

LPDDR3 DRAM; Temperature Grade: OTHER; No. of Terminals: 178; Package Code: BGA; Package Shape: RECTANGULAR; Terminal Position: BOTTOM;

DUAL BANK PAGE BURST

AUTO/SELF REFRESH

R-PBGA-B178

e1

11.5 mm

8589934592 bit

LPDDR3 DRAM

32

1

1

178

268435456 words

256M

SYNCHRONOUS

85 Cel

-30 Cel

256MX32

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

.85 mm

YES

1.3 V

1.14 V

1.2

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

10.5 mm

EDF8164A3PK-JD-F-D by Micron Technology

EDF8164A3PK-JD-F-D

Micron Technology

LPDDR3 DRAM; No. of Terminals: 216; Package Code: VFBGA; Package Shape: SQUARE; Access Mode: SINGLE BANK PAGE BURST; Operating Mode: SYNCHRONOUS;

SINGLE BANK PAGE BURST

AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOMINAL SUPPLY

S-PBGA-B216

12 mm

8589934592 bit

LPDDR3 DRAM

64

1

1

216

134217728 words

128M

SYNCHRONOUS

128MX64

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.7 mm

YES

1.3 V

1.14 V

1.2

YES

CMOS

BALL

.4 mm

BOTTOM

12 mm

EDF8164A3PK-JD-F-R by Micron Technology

EDF8164A3PK-JD-F-R

Micron Technology

LPDDR3 DRAM; No. of Terminals: 216; Package Code: VFBGA; Package Shape: SQUARE; Maximum Seated Height: .7 mm; Package Body Material: PLASTIC/EPOXY;

SINGLE BANK PAGE BURST

AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOMINAL SUPPLY

S-PBGA-B216

12 mm

8589934592 bit

LPDDR3 DRAM

64

1

1

216

134217728 words

128M

SYNCHRONOUS

128MX64

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.7 mm

YES

1.3 V

1.14 V

1.2

YES

CMOS

BALL

.4 mm

BOTTOM

12 mm

EDFA164A2PK-GD-F-D by Micron Technology

EDFA164A2PK-GD-F-D

Micron Technology

LPDDR3 DRAM; No. of Terminals: 216; Package Code: VFBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B216; No. of Words: 268435456 words;

DUAL BANK PAGE BURST

AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOMINAL SUPPLY

S-PBGA-B216

12 mm

17179869184 bit

LPDDR3 DRAM

64

1

1

216

268435456 words

256M

SYNCHRONOUS

256MX64

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

YES

1.3 V

1.14 V

1.2

YES

CMOS

BALL

.4 mm

BOTTOM

12 mm

EDFA164A2PK-JD-F-D by Micron Technology

EDFA164A2PK-JD-F-D

Micron Technology

LPDDR3 DRAM; No. of Terminals: 216; Package Code: VFBGA; Package Shape: SQUARE; Organization: 256MX64; Memory Width: 64;

DUAL BANK PAGE BURST

AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOMINAL SUPPLY

S-PBGA-B216

12 mm

17179869184 bit

LPDDR3 DRAM

64

1

1

216

268435456 words

256M

SYNCHRONOUS

256MX64

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

YES

1.3 V

1.14 V

1.2

YES

CMOS

BALL

.4 mm

BOTTOM

12 mm

MT52L1G32D4PG-107WT:B by Micron Technology

MT52L1G32D4PG-107WT:B

Micron Technology

LPDDR3 DRAM; Temperature Grade: OTHER; No. of Terminals: 178; Package Code: VFBGA; Package Shape: RECTANGULAR; Memory Width: 32;

DUAL BANK PAGE BURST

AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOMINAL SUPPLY

R-PBGA-B178

e1

12 mm

34359738368 bit

LPDDR3 DRAM

32

1

1

178

1073741824 words

1G

SYNCHRONOUS

85 Cel

-30 Cel

1GX32

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1 mm

YES

1.3 V

1.14 V

1.2

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

11.5 mm

EDF8132A3MA-GD-F-D by Micron Technology

EDF8132A3MA-GD-F-D

Micron Technology

LPDDR3 DRAM; No. of Terminals: 178; Package Code: VFBGA; Package Shape: RECTANGULAR; Terminal Position: BOTTOM; Package Body Material: PLASTIC/EPOXY;

DUAL BANK PAGE BURST

AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOMINAL SUPPLY; IT ALSO HAVE 0.65 MM PITCH

R-PBGA-B178

11.5 mm

8589934592 bit

LPDDR3 DRAM

32

1

1

178

268435456 words

256M

SYNCHRONOUS

256MX32

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

.85 mm

YES

1.3 V

1.14 V

1.2

YES

CMOS

BALL

.8 mm

BOTTOM

NOT SPECIFIED

10.5 mm

EDFA232A2MA-GD-F-D by Micron Technology

EDFA232A2MA-GD-F-D

Micron Technology

LPDDR3 DRAM; No. of Terminals: 178; Package Code: VFBGA; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Operating Mode: SYNCHRONOUS;

DUAL BANK PAGE BURST

AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOMINAL SUPPLY; IT ALSO HAVE 0.65 MM PITCH

R-PBGA-B178

11.5 mm

17179869184 bit

LPDDR3 DRAM

32

1

1

178

536870912 words

512M

SYNCHRONOUS

512MX32

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

1 mm

YES

1.3 V

1.14 V

1.2

YES

CMOS

BALL

.8 mm

BOTTOM

NOT SPECIFIED

10.5 mm

EDFA232A2MA-JD-F-D by Micron Technology

EDFA232A2MA-JD-F-D

Micron Technology

LPDDR3 DRAM; No. of Terminals: 178; Package Code: VFBGA; Package Shape: RECTANGULAR; No. of Words: 536870912 words; Surface Mount: YES;

DUAL BANK PAGE BURST

AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOMINAL SUPPLY; IT ALSO HAVE 0.65 MM PITCH

R-PBGA-B178

11.5 mm

17179869184 bit

LPDDR3 DRAM

32

1

1

178

536870912 words

512M

SYNCHRONOUS

512MX32

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

1 mm

YES

1.3 V

1.14 V

1.2

YES

CMOS

BALL

.8 mm

BOTTOM

NOT SPECIFIED

10.5 mm

MT52L256M64D2GN-107WT:B by Micron Technology

MT52L256M64D2GN-107WT:B

Micron Technology

LPDDR3 DRAM; No. of Terminals: 256; Package Code: VFBGA; Package Shape: SQUARE; Minimum Supply Voltage (Vsup): 1.14 V; Terminal Finish: TIN SILVER COPPER;

SINGLE BANK PAGE BURST

AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM

S-PBGA-B256

e1

14 mm

17179869184 bit

LPDDR3 DRAM

64

1

1

256

268435456 words

256M

SYNCHRONOUS

256MX64

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.7 mm

YES

1.3 V

1.14 V

1.2

YES

CMOS

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

14 mm

MT52L256M64D2LZ-107XT:B by Micron Technology

MT52L256M64D2LZ-107XT:B

Micron Technology

LPDDR3 DRAM; Temperature Grade: OTHER; No. of Terminals: 216; Package Code: VFBGA; Package Shape: SQUARE; Self Refresh: YES;

SINGLE BANK PAGE BURST

AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM

933 MHz

COMMON

S-PBGA-B216

12 mm

17179869184 bit

LPDDR3 DRAM

64

1

1

216

268435456 words

256M

SYNCHRONOUS

105 Cel

-30 Cel

256MX64

3-STATE

PLASTIC/EPOXY

VFBGA

BGA216,29X29,16

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

YES

.012 Amp

320 mA

1.3 V

1.14 V

1.2

YES

CMOS

OTHER

BALL

.4 mm

BOTTOM

12 mm

EDF8164A3MA-GD-F-D by Micron Technology

EDF8164A3MA-GD-F-D

Micron Technology

LPDDR3 DRAM; Temperature Grade: OTHER; No. of Terminals: 253; Package Code: VFBGA; Package Shape: SQUARE; Operating Mode: SYNCHRONOUS;

SINGLE BANK PAGE BURST

AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM

S-PBGA-B253

11 mm

8589934592 bit

LPDDR3 DRAM

64

1

1

253

134217728 words

128M

SYNCHRONOUS

85 Cel

-30 Cel

128MX64

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.85 mm

YES

1.3 V

1.14 V

1.2

YES

CMOS

OTHER

BALL

.5 mm

BOTTOM

11 mm

EDFA164A2MA-GD-F-D by Micron Technology

EDFA164A2MA-GD-F-D

Micron Technology

LPDDR3 DRAM; Temperature Grade: OTHER; No. of Terminals: 253; Package Code: VFBGA; Package Shape: SQUARE; Length: 11 mm;

DUAL BANK PAGE BURST

AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM

S-PBGA-B253

11 mm

17179869184 bit

LPDDR3 DRAM

64

1

1

253

268435456 words

256M

SYNCHRONOUS

85 Cel

-30 Cel

256MX64

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1 mm

YES

1.3 V

1.14 V

1.2

YES

CMOS

OTHER

BALL

.5 mm

BOTTOM

11 mm

EDFA164A2MA-JD-F-D by Micron Technology

EDFA164A2MA-JD-F-D

Micron Technology

LPDDR3 DRAM; Temperature Grade: OTHER; No. of Terminals: 253; Package Code: VFBGA; Package Shape: SQUARE; Minimum Supply Voltage (Vsup): 1.14 V;

DUAL BANK PAGE BURST

AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM

S-PBGA-B253

11 mm

17179869184 bit

LPDDR3 DRAM

64

1

1

253

268435456 words

256M

SYNCHRONOUS

85 Cel

-30 Cel

256MX64

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1 mm

YES

1.3 V

1.14 V

1.2

YES

CMOS

OTHER

BALL

.5 mm

BOTTOM

11 mm

EDFA364A3MA-GD-F-D by Micron Technology

EDFA364A3MA-GD-F-D

Micron Technology

LPDDR3 DRAM; Temperature Grade: OTHER; No. of Terminals: 253; Package Code: VFBGA; Package Shape: SQUARE; No. of Functions: 1;

SINGLE BANK PAGE BURST

AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM

S-PBGA-B253

12.5 mm

17179869184 bit

LPDDR3 DRAM

64

1

1

253

268435456 words

256M

SYNCHRONOUS

85 Cel

-30 Cel

256MX64

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

.85 mm

YES

1.3 V

1.14 V

1.2

YES

CMOS

OTHER

BALL

.5 mm

BOTTOM

NOT SPECIFIED

12.5 mm

EDFB164A1MA-GD-F-D by Micron Technology

EDFB164A1MA-GD-F-D

Micron Technology

LPDDR3 DRAM; Temperature Grade: OTHER; No. of Terminals: 253; Package Code: VFBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;

DUAL BANK PAGE BURST

AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM

S-PBGA-B253

12.5 mm

34359738368 bit

LPDDR3 DRAM

64

1

1

253

536870912 words

512M

SYNCHRONOUS

85 Cel

-30 Cel

512MX64

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.95 mm

YES

1.3 V

1.14 V

1.2

YES

CMOS

OTHER

BALL

.5 mm

BOTTOM

12.5 mm

EDFB164A1MA-JD-F-D by Micron Technology

EDFB164A1MA-JD-F-D

Micron Technology

LPDDR3 DRAM; Temperature Grade: OTHER; No. of Terminals: 253; Package Code: VFBGA; Package Shape: SQUARE; Self Refresh: YES;

DUAL BANK PAGE BURST

AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM

S-PBGA-B253

12.5 mm

34359738368 bit

LPDDR3 DRAM

64

1

1

253

536870912 words

512M

SYNCHRONOUS

85 Cel

-30 Cel

512MX64

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.95 mm

YES

1.3 V

1.14 V

1.2

YES

CMOS

OTHER

BALL

.5 mm

BOTTOM

12.5 mm

EDFP164A3PD-JD-F-D by Micron Technology

EDFP164A3PD-JD-F-D

Micron Technology

LPDDR3 DRAM; Temperature Grade: OTHER; No. of Terminals: 256; Package Code: VFBGA; Package Shape: SQUARE; No. of Words Code: 384M;

DUAL BANK PAGE BURST

AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM

S-PBGA-B256

14 mm

25769803776 bit

LPDDR3 DRAM

64

1

1

256

402653184 words

384M

SYNCHRONOUS

85 Cel

-30 Cel

384MX64

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

.8 mm

YES

1.3 V

1.14 V

1.2

YES

CMOS

OTHER

BALL

.4 mm

BOTTOM

NOT SPECIFIED

14 mm

MT52L256M64D2PP-107WT:B by Micron Technology

MT52L256M64D2PP-107WT:B

Micron Technology

LPDDR3 DRAM; Temperature Grade: OTHER; No. of Terminals: 216; Package Code: VFBGA; Package Shape: SQUARE; Organization: 256MX64;

SINGLE BANK PAGE BURST

AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM

CONFIGURABLE

S-PBGA-B216

12 mm

17179869184 bit

LPDDR3 DRAM

64

1

1

216

268435456 words

256M

SYNCHRONOUS

85 Cel

-30 Cel

256MX64

COMMON

PLASTIC/EPOXY

VFBGA

BGA216,12X12,16

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NO

.8 mm

YES

1.3 V

1.14 V

1.2

YES

CMOS

OTHER

BALL

.4 mm

BOTTOM

12 mm