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176 Latches & Flip-Flops 4

Latches & Flip-Flops
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Count Direction Family JESD-30 Code JESD-609 Code Length Load Capacitance (CL) Logic IC Type Maximum Frequency At Nominal Supply Maximum I (ol) Moisture Sensitivity Level (MSL) No. of Bits No. of Functions No. of Inputs No. of Ports No. of Terminals Maximum Operating Temperature Minimum Operating Temperature Output Characteristics Output Polarity Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Packing Method Peak Reflow Temperature (C) Power Supplies (V) Maximum Power Supply Current (ICC) Propagation Delay (tpd) Qualification Schmitt Trigger Screening Level Maximum Seated Height Sub-Category Maximum Supply Voltage (Vsup) Minimum Supply Voltage (Vsup) Nominal Supply Voltage / Vsup (V) Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Trigger Type Width Minimum fmax
SSTUB32868ET/G,518 by NXP Semiconductors

SSTUB32868ET/G,518

NXP Semiconductors

D FLIP-FLOP; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 176; Package Code: TFBGA; Package Shape: RECTANGULAR;

32868

R-PBGA-B176

15 mm

D FLIP-FLOP

28

1

176

70 Cel

0 Cel

TRUE

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

3 ns

Not Qualified

1.15 mm

2 V

1.7 V

1.8

YES

COMMERCIAL

BALL

.65 mm

BOTTOM

POSITIVE EDGE

6 mm

450 MHz

SSTUG32868ET/G,518 by NXP Semiconductors

SSTUG32868ET/G,518

NXP Semiconductors

D FLIP-FLOP; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 176; Package Code: TFBGA; Package Shape: RECTANGULAR;

32868

R-PBGA-B176

15 mm

D FLIP-FLOP

2

28

1

176

70 Cel

0 Cel

OPEN-DRAIN

COMPLEMENTARY

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

1.5 ns

Not Qualified

1.15 mm

2 V

1.7 V

1.8

YES

CMOS

COMMERCIAL

BALL

.65 mm

BOTTOM

POSITIVE EDGE

6 mm

450 MHz

SSTUG32868ET/S,518 by NXP Semiconductors

SSTUG32868ET/S,518

NXP Semiconductors

D FLIP-FLOP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 176; Package Code: TFBGA; Package Shape: RECTANGULAR;

32868

R-PBGA-B176

15 mm

D FLIP-FLOP

2

28

1

176

85 Cel

0 Cel

OPEN-DRAIN

COMPLEMENTARY

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

1.5 ns

Not Qualified

1.15 mm

2 V

1.7 V

1.8

YES

CMOS

OTHER

BALL

.65 mm

BOTTOM

POSITIVE EDGE

6 mm

450 MHz

SSTUB32868ET/S,518 by NXP Semiconductors

SSTUB32868ET/S,518

NXP Semiconductors

D FLIP-FLOP; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: BALL; No. of Terminals: 176; Package Code: TFBGA; Package Shape: RECTANGULAR;

32868

R-PBGA-B176

15 mm

D FLIP-FLOP

2

28

1

176

85 Cel

0 Cel

TRUE

PLASTIC/EPOXY

TFBGA

BGA176,8X22,25

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

1.8

3 ns

Not Qualified

1.15 mm

Other Logic ICs

2 V

1.7 V

1.8

YES

COMMERCIAL EXTENDED

BALL

.65 mm

BOTTOM

POSITIVE EDGE

6 mm

450 MHz