Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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MAX192BEWP
Maxim Integrated
ADC, SUCCESSIVE APPROXIMATION; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR;
Analog To Digital Converter, Successive Approximation
8
1
10
Analog to Digital Converters
Binary, 2's Complement Binary
Serial
0.0977 %
133 kHz
Track
2 µs
5 V
-2.048 V
2.048 V
-40 °C (-40 °F)
85 °C (185 °F)
Industrial
245 °C (473 °F)
Dual
20
Gull Wing
0.05 in (1.27 mm)
Yes
0.295 in (7.5 mm)
0.504 in (12.8 mm)
0.104 in (2.65 mm)
Plastic/Epoxy
Small Outline
Rectangular
SOP20,.3
SOP
R-PDSO-G20
No
e0
MAX138CPL
ADC, DUAL-SLOPE; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 40; Package Code: DIP; Package Shape: RECTANGULAR;
Analog To Digital Converter, Dual-Slope
24
Binary
Parallel, Word
0.0015 %
200 mV
0 °C (32 °F)
70 °C (158 °F)
Commercial
40
Through-Hole
0.1 in (2.54 mm)
0.6 in (15.24 mm)
2.05 in (52.075 mm)
0.2 in (5.08 mm)
In-Line
DIP40,.6
DIP
R-PDIP-T40
MAX140EPL
ADC, DUAL-SLOPE; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 40; Package Code: DIP; Package Shape: RECTANGULAR;
MAX138EQH
ADC, DUAL-SLOPE; Temperature Grade: INDUSTRIAL; Terminal Form: J BEND; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE;
3
Quad
44
J Bend
0.653 in (16.585 mm)
0.18 in (4.57 mm)
Chip Carrier
Square
LDCC44,.7SQ
QCCJ
S-PQCC-J44
MX7824KN
ADC, FLASH METHOD; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 24; Package Code: DIP; Package Equivalence Code: DIP24(UNSPEC);
Analog To Digital Converter, Flash Method
4
Complementary Offset Binary
Parallel, 8 Bits
2.4 µs
0 mV
5.25 V
DIP24(UNSPEC)
MX7824LCWG
ADC, FLASH METHOD; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SOP; JESD-609 Code: e0;
SO24(UNSPEC)
MX7828LCWI
ADC, FLASH METHOD; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SOP; Terminal Finish: TIN LEAD;
28
SO28(UNSPEC)
MX7821KN
ADC, FLASH METHOD; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR;
400 ns
5,GND/-5 V
-2.5 V
2.5 V
-5 V
0.3 in (7.62 mm)
1.03 in (26.16 mm)
0.18 in (4.572 mm)
DIP20,.3
R-PDIP-T20
MX7672KP10
ADC, SUCCESSIVE APPROXIMATION; Temperature Grade: COMMERCIAL; Terminal Form: J BEND; No. of Terminals: 28; Package Code: QCCJ; Package Shape: SQUARE;
2
12
0.0244 %
10.4 µs
5,-12 V
-12 V
0.453 in (11.505 mm)
LDCC28,.5SQ
S-PQCC-J28
MAX152CAP
ADC, FLASH METHOD; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SSOP; Package Shape: RECTANGULAR;
400 kHz
2.3 µs
3/±3 V
-3.6 V
3.6 V
3.3 V
0.026 in (0.65 mm)
0.208 in (5.29 mm)
0.283 in (7.2 mm)
0.078 in (1.99 mm)
Small Outline, Shrink Pitch
SSOP20,.3
SSOP
MAX152CWP
ADC, FLASH METHOD; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR;
SOP20,.4
MAX152EAP
ADC, FLASH METHOD; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SSOP; Package Shape: RECTANGULAR;
MAX152EWP
ADC, FLASH METHOD; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR;
MAX153CPP
0.39 %
1 MHz
875 ns
MAX153EAP
MAX120C/D
ADC, SUCCESSIVE APPROXIMATION; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: DIE; Package Shape: RECTANGULAR;
500 kHz
1.63 µs
5,-12/-15 V
-15 V
Upper
No Lead
Uncased Chip
DIE OR CHIP
DIE
R-XUUC-N24
MAX120CNG
ADC, SUCCESSIVE APPROXIMATION; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR;
2's Complement Binary
0.024 %
1.203 in (30.545 mm)
DIP24,.3
R-PDIP-T24
MAX120ENG
ADC, SUCCESSIVE APPROXIMATION; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR;
MAX120CAG
ADC, SUCCESSIVE APPROXIMATION; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SSOP; Package Shape: RECTANGULAR;
41.6 kHz
0.323 in (8.2 mm)
SSOP24,.3
R-PDSO-G24
MAX120CWG
ADC, SUCCESSIVE APPROXIMATION; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SOP; Package Shape: RECTANGULAR;
0.606 in (15.4 mm)
SOP24,.4
MAX120EWG
ADC, SUCCESSIVE APPROXIMATION; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SOP; Package Shape: RECTANGULAR;
MAX1248BCPE
ADC, SUCCESSIVE APPROXIMATION; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
13.3 kHz
65 µs
3/5 V
-1.25 V
1.25 V
3 V
16
0.755 in (19.175 mm)
DIP16,.3
R-PDIP-T16
MAX1249BCPE
MAX1249BEPE
ADC, SUCCESSIVE APPROXIMATION; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
MAX174ACPI
ADC, SUCCESSIVE APPROXIMATION; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR;
Binary, Offset Binary
0.012 %
8 µs
5,±12/±15 V
-10 V
10 V
15 V
10 mA
1.45 in (36.83 mm)
DIP28,.6
R-PDIP-T28
MAX174AEPI
ADC, SUCCESSIVE APPROXIMATION; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR;
MAX174BCPI
MAX174CCPI
MAX1248ACEE
ADC, SUCCESSIVE APPROXIMATION; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR;
0.0488 %
0.025 in (0.635 mm)
0.154 in (3.9 mm)
0.193 in (4.9 mm)
0.069 in (1.75 mm)
SSOP16,.25
R-PDSO-G16
MAX1248AEEE
ADC, SUCCESSIVE APPROXIMATION; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR;
MAX1248BCEE
MAX1249ACEE
MAX1249BCEE
MAX1249BEEE
MAX174ACWI
ADC, SUCCESSIVE APPROXIMATION; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR;
0.705 in (17.9 mm)
SOP28,.4
R-PDSO-G28
MAX174AEWI
ADC, SUCCESSIVE APPROXIMATION; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR;
MAX174BCWI
MAX174BEWI
MAX174CCWI
MAX174CEWI
MX574AJEWI
MX574AJEWI by Maxim Integrated is a 12-bit ADC with 0.012% EL, operating at -40 to 85 °C. It has a conversion time of 25 us and supports binary/offset binary output codes. Ideal for industrial applications requiring precise analog-to-digital conversion within a compact small outline package.
25 µs
MX574AKEWI
ICL7135CQI
ICL7135CQI by Maxim Integrated is a 4-bit ADC with 0.005% EL, +-5V supplies, and CMOS technology. It's used in commercial applications for accurate analog-to-digital conversion due to its dual-slope converter type and 2V max analog input voltage. The chip carrier package style makes it suitable for surface mount designs with a compact size of 11.505mm x 11.505mm.
Binary, Binary Coded Decimal
Parallel, 4 Bits
0.005 %
±5 V
-2 V
2 V
MAX144ACPA
ADC, SUCCESSIVE APPROXIMATION; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
0.0122 %
108 kHz
7 µs
5.3 V
0.369 in (9.375 mm)
DIP8,.3
R-PDIP-T8
MAX144AEPA
ADC, SUCCESSIVE APPROXIMATION; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
MAX144BCPA
MAX144BEPA
MAX145BCPA
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