Partstack Future Leaders in Engineering Scholarship

Are you a builder? a dreamer? an engineer in the making?

Then our Future Leaders in Engineering Scholarship is just for you!
Partstack Corporation is offering up to four (4) $2,500 scholarship awards to students who are interested in pursuing (or currently pursuing) engineering majors (and related sciences majors) at a 2 or 4-year institution.

Our future depends on semiconductors. As America grapples with recent semiconductor microchip shortages, an educated engineering workforce must be ready to meet the challenge. Our Future Leaders in Engineering Scholarship was founded to ensure that the next generation of diverse engineering leadership has an opportunity to pursue higher education to tackle this and other major engineering problems.

Who is Eligible

Our scholarship is open to all high school seniors, undergraduates, and graduate students who will be/are attending college engineering programs in the United States.
There are no GPA requirements, but you must be in good academic standing and be able to demonstrate enrollment at a 2 or 4-year institution if selected as a Partstack Future Leader in Engineering recipient.

To Enter:

You may also submit your materials directly to us at [email protected], but please do not submit more than once.

To be considered, students must plan to major in one of the following areas:

Computer Science
Computer Engineering
Electrical Engineering
Electronics Engineering
Information Systems
Information Technology
Aerospace Engineering
Aeronautical Engineering

Software Engineering
Math/Applied Math
Data Science
Materials Science
Management Information Systems
Mechanical Engineering
Robotics
Physics

Eligible non-STEM majors include supply chain, logistics, purchasing, and business majors with a demonstrated interest in semiconductors/engineering.
If you don’t see your planned major listed above, you can email us to be sure.

2023-2024 Prompt

Are you working on a project that uses electronic parts and components?

Tell us what you’re building right now.

What problem are you trying to solve? What are your challenges? Why is this project important and how will pursuing an engineering education help?

If you haven’t started building something, tell us about a project you’re interested in building or working on with your future engineering education.

The deadline for all applications is January 6.

About Partstack

Partstack is a new semiconductor/electronic components marketplace for the makers, dreamers, and mold-breakers who are building the awesome things that power our world. Whether you’re building a robotic arm, a calculator, or a jet—we’ve got you covered with the LEDs, resistors, microchips, etc! you need to get things going. You’ll find datasheets, tech specs, and more for over 1 billion parts and growing.

What we’re looking for

Creativity and passion. Your entry will be judged on the overall presentation quality and how well you respond to the prompt. Just be yourself! We may request additional details in February/March if your application stands out and makes it into the final rounds of consideration!
Winners will be contacted directly and will be announced publicly in May on Instagram—so follow us to stay in the loop! Scholarship funds will be paid directly to your college of choice.

Terms and Conditions:

You agree that you have read and fully meet the eligibility requirements for this award.
By submitting your application you are authorizing Partstack and its partners to share and repost entries across our social media channels and website. Participants retain the underlying intellectual property of their submissions. However, by submitting a photo/video/essay to the contest, you are giving Partstack an unrestricted license to share, reproduce, and/or exhibit them without restriction, and without notification or compensation. Uses include but are not limited to: sharing with partner organizations, including in future projects and reports, sharing with federal, state, and local governments, promoting future contests, media outreach, and including in funding proposals.
You agree that your submission is truthful, valid, and can be corroborated and verified. You also agree to provide additional details if needed for our team to make a scholarship decision.
Void where prohibited.